Electronic component and manufacturing method thereof

An electronic component comprising:

• an element body including a first end surface and a second end surface opposite to each other, and an upper surface connecting the first end surface and the second end surface;
• a circuit element embedded in the element body;
• a first lead-out electrode embedded on the first end surface side of the element body and electrically connected to the circuit element;
• a columnar electrode arranged separately from the first lead-out electrode in a first direction when viewed in a direction orthogonal to the first end surface, and embedded in the element body with a portion exposed from the first end surface to the upper surface;
• and
• a first via conductor connecting the first lead-out electrode and the columnar electrode, wherein
• with regard to an exposure width on the first end surface along a second direction orthogonal to the first direction when viewed in the direction orthogonal to the first end surface, the exposure width of the first via conductor is smaller than the exposure width of the columnar electrode.