Chip resistor and method for manufacturing the same

A chip resistor comprising:

• a substrate including a first surface, a second surface opposite to the first surface, and a side surface disposed between the first surface and the second surface in a thickness direction of the substrate, the first surface including a first end part and a second end part that are spaced apart from each other in a first direction in plan view;
• an upper electrode located on the first end part of the first surface;
• a resistor element located on the first surface of the substrate and electrically connected to the upper electrode;
• a first insulating layer covering the upper electrode and the resistor element;
• a second insulating layer formed on the first insulating layer;
• a protective layer formed on the upper electrode and including a portion located between the first insulating layer and the second insulating layer in the thickness direction;
• and
• a side electrode electrically connected to the upper electrode and including a first portion and a second portion, the first portion being located on the side surface of the substrate, the second portion overlapping with the first surface of the substrate in plan view,
• wherein the upper electrode includes a first portion located between the substrate and the resistor element in the thickness direction, and a second portion that does not overlap with the resistor element in plan view, and that has a uniform thickness,
• the protective layer includes an inner surface held in contact with the upper electrode and an outer surface opposite to the inner surface, and the outer surface is greater in length measured in the first direction than the inner surface, and
• the second portion of the side electrode and the second insulating layer have respective ends held in contact with each other on the outer surface of the protective layer.