Apparatuses and methods for soft post-package repair
AssigneeMicron Technology, Inc.
InventorAlan J. Wilson
Life of this patent
Estimating the term…
Abstract
Embodiments of the disclosure are drawn to apparatuses and methods for soft post-package repair (SPPR). After packaging, it may be necessary to perform post-package repair operations on rows of the memory. During a scan mode of an SPPR operation, addresses provided by a fuse bank may be examined to determine if they are open addresses or if the bad row of memory is a redundant row of memory. The open addresses and the bad redundant addresses may be stored in volatile storage elements, such as in latch circuits. During a soft send mode of a SPPR operation, the address previously associated with the bad row of memory may be associated with the open address instead, and the address of the bad redundant row may be disabled.
Claims8
An apparatus comprising:
- a latch bank comprising a plurality of latch circuits, each of the plurality of latch circuits configured to store a fuse bank address;
- a logic circuit configured to receive addresses along a fuse bus, the logic circuit configured to provide a command signal to the latch bank having a level based on a value of an address on the fuse bus, wherein responsive to the command signal, the latch bank is configured to store a fuse bank address associated with the address on the fuse bus in one of the plurality of latch circuits;
- and
- a soft post-package repair (SPPR) circuit configured to determine when an address along the fuse bus matches a latched fuse bank address provided by the latch bank and alter the address before providing the altered address along the fuse bus.
Dependencies are inferred from the claim text.