Multichannel tape head module having embedded thermal device
AssigneeInternational Business Machines Corporation
InventorsRobert G. Biskeborn, Calvin S. Lo
Life of this patent
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Abstract
In one embodiment, an apparatus includes a module having: an array of transducers formed in thin film structure on a substrate, the array being positioned along a tape bearing surface of the module, and a heating element positioned in the thin film structure and recessed from the tape bearing surface. An apparatus, according to another embodiment, includes a module having an array of transducers formed on a substrate, the array being positioned along a tape bearing surface of the module between skiving edges thereof. A slot is formed in the substrate adjacent one of the skiving edges. A heating element is positioned in the slot.
Claims20
An apparatus, comprising:
- a module having:
- an array of transducers formed in thin film structure on a substrate, the array being positioned along a tape bearing surface of the module;
- and
- a heating element positioned in the thin film structure and recessed from the tape bearing surface.
An apparatus, comprising:
- a module having an array of transducers formed on a substrate, the array being positioned along a tape bearing surface of the module between skiving edges thereof;
- a slot formed in the substrate adjacent one of the skiving edges;
- and
- a heating element positioned in the slot.
Dependencies are inferred from the claim text.