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US 10,832,712 B1Granted
Magnetic thin film recording head module having electrical shielding between read and write transducer arrays
AssigneeInternational Business Machines Corporation
InventorsDavid Seagle, Robert Biskeborn, Calvin Shyhjong Lo
Life of this patent
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Abstract
An apparatus, in accordance with one approach, includes a module having a first array of read transducers. A first electrical shielding layer is positioned above the first array of read transducers. An array of write transducers is positioned above the first electrical shielding layer. A second electrical shielding layer is positioned above the array of write transducers. A second array of read transducers is positioned above the second electrical shielding layer.
Claims22
An apparatus, comprising:
- a module having:
- a first array of read transducers;
- a first electrical shielding layer above the first array of read transducers;
- an array of write transducers above the first electrical shielding layer;
- a second electrical shielding layer above the array of write transducers;
- a second array of read transducers above the second electrical shielding layer;
- first leads extending from the read transducers in the first array to a first pad area of the module;
- second leads extending from the write transducers to a second pad area of the module that is spaced from the first pad area;
- and
- third leads extending from the read transducers in the second array to a third pad area of the module that is spaced from the first and second pad areas,
- wherein a width of at least one of the electrical shielding layers in a direction parallel to the array of write transducers is greater than a distance between outermost ones of the second leads.
8 more elements
An apparatus, comprising:
- a module having:
- a first array of read transducers;
- a first electrical shielding layer above the first array of read transducers;
- an array of write transducers above the first electrical shielding layer;
- a second electrical shielding layer above the array of write transducers;
- a second array of read transducers above the second electrical shielding layer;
- first leads extending from the read transducers in the first array to a first pad area of the module;
- second leads extending from the write transducers to a second pad area of the module that is spaced from the first pad area;
- and
- third leads extending from the read transducers in the second array to a third pad area of the module that is spaced from the first and second pad areas,
- wherein a width of at least one of the electrical shielding layers in a direction parallel to the array of write transducers is less than a distance between a pad in the first pad area and a pad in the third pad area positioned closest together.
8 more elements
A method for fabricating a module, the method comprising:
- forming a first array of data transducers of a first type;
- forming a first electrical shielding layer above the first array of data transducers;
- forming an array of data transducers of a second type above the first electrical shielding layer;
- forming a second electrical shielding layer above the array of data transducers of the second type;
- forming a second array of data transducers above the second electrical shielding layer;
- forming first leads extending from the data transducers in the first array to a first pad area;
- and
- forming second leads extending from the data transducers of the second type to a second pad area that is spaced from the first pad area;
- forming third leads extending from the data transducers in the second array to a third pad area that is spaced from the first and second pad areas,
- wherein a width of at least one of the electrical shielding layers in a direction parallel to the array of data transducers of the second type is greater than a distance between outermost ones of the second leads.
7 more elements
Dependencies are inferred from the claim text.