Chip transferring machine
AssigneeAsti Global Inc., Taiwan
InventorChien-Shou Liao
Life of this patent
Estimating the term…
Abstract
A chip transferring machine includes a chip carrier, a chip transferring module, and a chip carrier substrate. The chip carrier carries a plurality of chips. The chip transferring module includes at least one conveyor belt having an adhesive surface. The chip carrier substrate carries the plurality of chips. The chip carrier, the chip transferring module, and the chip carrier substrate are disposed on a same production line, and the chip carrier and the chip carrier substrate are disposed under or above the adhesive surface of the conveyor belt.
Claims8
A chip transferring machine, comprising:
- a chip carrier carrying a plurality of chips;
- a chip transferring module including at least one conveyor belt having an adhesive surface;
- a chip carrier substrate carrying the plurality of chips;
- and
- a laser generating module and a vacuum suction module, wherein the laser generating module and the vacuum suction module are disposed above or under the conveyor belt, and a laser beam generated by the laser generating module passes through the conveyor belt to project onto a solder disposed on at least one of the chips, and the vacuum suction module suctions a non-adhesive surface of the conveyor belt to adjust the flatness of the conveyor belt;
- wherein the chip carrier, the chip transferring module, and the chip carrier substrate are disposed on a same production line, and the chip carrier and the chip carrier substrate are both disposed under or above the adhesive surface of the conveyor belt.
A chip transferring machine comprising a chip carrier, a chip transferring module, a chip carrier substrate, a laser generating module and a vacuum suction module, wherein the chip transferring module includes at least one conveyor belt having an adhesive surface, and the chip carrier and the chip carrier substrate are disposed under or above the adhesive surface of the conveyor belt, and wherein the laser generating module and the vacuum suction module are disposed above or under the conveyor belt, and a laser beam generated by the laser generating module passes through the conveyor belt to project onto a solder disposed on at least one chip, and the vacuum suction module suctions a non-adhesive surface of the conveyor belt to adjust the flatness of the conveyor belt.
Dependencies are inferred from the claim text.