Baking device for a wafer coated with a coating containing a solvent
AssigneeSuss Microtec Lithography GmbH
InventorsGregory George, Aaron Foley, Oliver Treichel
Life of this patent
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Abstract
A baking device for a wafer coated with a coating containing a solvent is described, having a baking chamber, a support for the wafer, an inlet for a purge gas, and an evacuation for the purge gas charged with solvent evaporated from the coating. The inlet is formed as a diffusion element arranged above the wafer so as to admit the purge gas evenly over substantially the entire surface of the wafer, and the evacuation is formed as an evacuation ring which radially surrounds the diffusion element and is arranged at a ceiling of the baking chamber.
Claims14
A baking device for a wafer coated with a coating containing a solvent, the baking device comprising:
- a baking chamber;
- a support for the wafer, the support being integrated within the baking chamber and configured for placement of the wafer on the support;
- an inlet for purge gas, the inlet being formed as a diffusion element arranged above the wafer so as to admit the purge gas evenly over substantially the entire surface of the wafer;
- an evacuation for the purge gas charged with solvent evaporated from the coating, the evacuation being formed as an evacuation ring radially surrounding the diffusion element and arranged at a ceiling of the baking chamber, wherein the evacuation ring provides a flow connection out of the baking chamber at the ceiling;
- and
- a discharge system that connects with an exhaust system, the discharge system comprising a plurality of discharge channels connected to the flow connection, wherein the plurality of discharge channels are connected to an evacuation channel formed behind the evacuation ring, wherein the evacuation channel and the plurality of discharge channels are integrated into a ceiling element which forms the ceiling of the baking chamber and which centrally comprises the diffusion element.
A baking device for a wafer coated with a coating containing a solvent, the baking device comprising:
- a baking chamber;
- a support for the wafer, the support being integrated within the chamber and configured for placement of the wafer on the support;
- an inlet for purge gas, the inlet being formed as a diffusion element arranged above the wafer so as to admit the purge gas evenly over substantially the entire surface of the wafer;
- and
- an evacuation for the purge gas charged with solvent evaporated from the coating, the evacuation being formed as an evacuation ring radially surrounding the diffusion element and arranged at a ceiling of the baking chamber, wherein the evacuation ring provides a flow connection out of the baking chamber at the ceiling, the evacuation ring at least partially capping an exhaust pathway out of the baking chamber, and wherein the evacuation ring clamps the diffusion element to a ceiling element which forms the ceiling of the baking chamber.
Dependencies are inferred from the claim text.