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US 10,822,274 B1Granted
Respirable silica-free joint compound formulation
AssigneeBoard-Sil, LLC
InventorVaidehi Hiremath
Life of this patent
Estimating the term…
Abstract
Materials and methods for joining wallboard panels may include joint compounds that include one or more filler materials (e.g., perlite, calcium carbonate, kaolin, and attapulgite), binder materials (e.g., polyvinyl acetates, acrylics, polyvinyl alcohols, re-dispersible powders, ethylene vinyl acetates, and starches), additives (e.g., hydroxypropylmethyl cellulose, preservatives, Potassium Bitartrate, antifreeze and/or plasticizers), thickeners, and/or suspending agents.
Claims8
A joint compound formulation comprising
- about 0.1 wt. % to about 5 wt. % of potassium bitartrate,
- about 5 wt. % to about 25 wt. % of at least one latex-free binder selected from the group consisting of starches and starch-based binders,
- about 60 wt. % to about 80 wt. % of one or more fillers selected from the group consisting of perlite, calcium carbonate, kaolin, limestone, and attapulgite,
- about 1 wt % to about 15 wt. % of one or more thickeners comprising hydroxypropylmethyl cellulose, carboxymethyl cellulose, or a combination thereof,
- and 0.1 to 1 wt. % of a preservative, and
- wherein the formulation exhibits a coverage rating of about 15 lbs. to cover an area of about 125 square feet and has no mica and/or no talc.
3 more elements
Dependencies are inferred from the claim text.