Termination ring with gapped metallic layer
AssigneeHewlett-Packard Development Company, L.P.
InventorsAnthony M Fuller, Terry McMahon, Donald W Schulte
Life of this patent
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Abstract
In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the number of rows of nozzles. A termination ring is disposed on the substrate and surrounds the rows of nozzles. The termination ring includes a first metallic layer that is an enclosed shape and a second metallic layer that is disposed on top of the first metallic layer. The second metallic layer includes a gap positioned adjacent the number of bond pads.
Claims15
A fluid ejection device comprising:
- a substrate;
- a number of rows of nozzles formed within the substrate to eject fluid;
- a number of bond pads disposed on the substrate and electrically coupled to the number of rows of nozzles;
- a termination ring disposed on the substrate that surrounds the rows of nozzles, wherein, the termination ring comprises:
- a first metallic layer that is an enclosed shape;
- and
- a second metallic layer disposed on top of the first metallic layer, the second metallic layer comprising a gap positioned adjacent the number of bond pads.
A method of forming a termination ring on a fluid ejection device, the method comprising:
- forming an enclosed first metallic layer of the termination ring on a substrate of the fluid ejection device;
- forming an enclosed second metallic layer on the enclosed first metallic layer;
- removing a portion of the enclosed second metallic layer that is adjacent a bond pad region of the fluid ejection device to form a gapped second metallic layer of the termination ring.
A fluid ejection device comprising:
- a substrate;
- a number of rows of nozzles formed within the substrate to eject fluid;
- a number of bond pads disposed on the substrate to electrically couple the number of rows of nozzles to a controller;
- a termination ring disposed on the substrate that surrounds the rows of nozzles and the number of bond pads to mechanically and electrically protect the number of rows of nozzles, wherein, the termination ring comprises:
- a bond pad region comprising just a first metallic layer;
- and
- a non-bond pad region comprising the first metallic layer and a second metallic layer disposed on the first metallic layer.
Dependencies are inferred from the claim text.