Soldering apparatus and method for manufacturing electronic unit

A cleaning unit for cleaning a soldering apparatus, comprising:

• a soldering iron having a soldering tip for carrying out a soldering process to a processing object;
• and
• a heater configured to heat the soldering iron,
• a gas supply device connected to the soldering iron, the gas supply device being configured to operatively supply a burning-assist gas to the soldering iron, and
• wherein the gas supply device comprises:
• a gas separator configured to separate air into nitrogen gas having a nitrogen density higher than that of the air and oxygen-rich gas having an oxygen density higher than that of the air, wherein the oxygen-rich gas is used as the burning-assist gas;
• and
• a gas switching valve configured to switch gas to be supplied to the soldering iron from the nitrogen gas to the oxygen-rich gas, or vice versa.

A manufacturing method for an electronic control unit comprising:

• providing a soldering apparatus to mount an electronic component to a printed circuit board of an, wherein the soldering apparatus comprises:
• a soldering iron having a soldering tip for carrying out a soldering process to the printed circuit board,
• a heater unit for heating configured to heat the soldering iron unit, and
• a gas supply device for operatively supplying a burning-assist gas to the soldering iron during a cleaning process for the soldering iron;
• soldering the printed circuit board, in which solder is supplied to the soldering iron and the soldering is carried out by the soldering tip, which is heated by the heater;
• and
• cleaning the soldering iron after the soldering of the printed circuit board is stopped, in which the soldering iron is heated by the heater and the burning-assist gas is supplied from the gas supply device to the soldering iron in order to clean the soldering iron.