Packaging structure comprising at least one transition forming a contactless interface

A high frequency packaging structure comprising:

• at least one transition between a first transmission line and a second transmission line,
• said first transmission line being a planar transmission line,
• a split-block assembly with a first conducting block section and a second conducting block section and at least one input/output port,
• said first transmission line is arranged on a substrate or forms part of a circuit arrangement arranged on a substrate disposed on the first conducting block section and comprises or is connected to a coupling section,
• the first conducting block section further, for the, or each, transition, comprises a cavity with a cavity opening in an upper surface of the first conducting block section and said first transmission line is so arranged that the coupling section will be located in the cavity opening in an assembled state of the split-block assembly,
• said second transmission line being arranged in line with said first transmission line on an opposite side of the cavity opening for providing a transition between said first and second transmission lines,
• the second conducting block section is arranged to act as a lid or a cover in an assembled state of the high frequency packaging structure,
• one of the conducting block sections is provided with a high impedance surface or an AMC surface arranged along or facing said first and second transmission lines at the transition, and
• there being a narrow gap between the high impedance surface or the AMC surface and an opposing surface of the other conducting block section in the assembled state of the split-block assembly at least in the transition region such that the, or each, transition between said first transmission line and said second transmission line being contactless without any galvanic contact between said first transmission line and said second transmission line.