Spatially variable wafer bias power system
AssigneeEagle Harbor Technologies, Inc.
InventorsTimothy Ziemba, Ilia Slobodov, John Carscadden, Kenneth Miller, James Prager
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AssigneeEagle Harbor Technologies, Inc.
InventorsTimothy Ziemba, Ilia Slobodov, John Carscadden, Kenneth Miller, James Prager
Estimating the term…
A plasma deposition system comprising a wafer platform, a second electrode, a first electrode, a first high voltage pulser, and a second high voltage pulser. In some embodiments, the second electrode may be disposed proximate with the wafer platform. In some embodiments, the second electrode can include a disc shape with a central aperture; a central axis, an aperture diameter, and an outer diameter. In some embodiments, the first electrode may be disposed proximate with the wafer platform and within the central aperture of the second electrode. In some embodiments, the first electrode can include a disc shape, a central axis, and an outer diameter. In some embodiments, the first high voltage pulser can be electrically coupled with the first electrode. In some embodiments, the second high voltage pulser can be electrically coupled with the second electrode.
A power system with plasma load comprising:
Dependencies are inferred from the claim text.