Sensor packaging structure and manufacturing method thereof

A sensor packaging structure, comprising a protection board, a circuit structure and a filling structure, wherein a front surface of the circuit structure is connected to a first surface of the protection board, and a second surface of the protection board is used as a sensing function surface;

• the filling structure is formed on an outer periphery of the circuit structure and connected to the first surface of the protection board, forming an accommodating space to enclose the circuit structure;
• the circuit structure includes a chip and a substrate, and the chip is connected back-to-back to the substrate;
• a front surface of the chip is located on the front surface of the circuit structure and is provided with a functional circuit;
• and
• a front surface of the substrate is located on a back surface of the circuit structure and is provided with a pad,
• wherein the protection board comprises a first part and a second part arranged around the first part, the first part is used for carrying the circuit structure, and the filling structure is connected to the second part;
• and
• wherein the filling structure and the first part are separated from each other.