Microassembly of heterogeneous materials
AssigneeThe Board of Trustees of the University of Illinois
InventorsSeok Kim, Zining Yang, Hohyun Keum
Life of this patent
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Abstract
A method for microassembly of heterogeneous materials comprises contacting a stamp with an ink disposed on a donor substrate to form an inked stamp, where the ink is reversibly bound to the stamp. The inked stamp is stamped onto a receiving substrate or onto an object on the receiving substrate, and the stamp is removed, thereby transferring the ink to the receiving substrate. The ink and the receiving substrate or the ink and the object are thermally joined, thereby forming a microassembly of heterogeneous materials. The ink may comprise a first material and the receiving substrate or the object may comprise a second material different from the first material.
Claims17
A method for microassembly of heterogeneous materials, the method comprising:
- contacting a stamp with a solid-phase ink disposed on a donor substrate to form an inked stamp, where the solid-phase ink is reversibly bound to the stamp;
- stamping the inked stamp onto a receiving substrate or onto an object on the receiving substrate, wherein the solid-phase ink comprises a first material and the receiving substrate or the object comprises a second material different from the first material;
- removing the stamp, thereby transferring the solid-phase ink to the receiving substrate;
- and
- thermally joining the solid-phase ink with the receiving substrate or the object, thereby forming a microassembly of heterogeneous materials,
- wherein the first material comprises SU-8 and the second material is selected from the group consisting of:
- SiO2, Si, and Au.
A method for microassembly of heterogeneous materials, the method comprising:
- fabricating a solid-phase ink comprising a polymer on a donor substrate, wherein the fabricating comprises:
- coating a sacrificial layer onto a silicon substrate;
- coating a polymeric material on the sacrificial layer and curing to form a polymer layer;
- patterning the polymer layer to form a polymeric ink pattern;
- and
- removing the sacrificial layer, thereby forming the solid-phase ink comprising the polymer for transfer printing;
- contacting a stamp with the solid-phase ink disposed on the donor substrate to form an inked stamp, where the solid-phase ink is reversibly bound to the stamp;
- stamping the inked stamp onto a receiving substrate or onto an object on the receiving substrate, wherein the receiving substrate or the object comprises a material different from the polymer;
- removing the stamp, thereby transferring the solid-phase ink to the receiving substrate;
- and
- thermally joining the solid-phase ink with the receiving substrate or the object, thereby forming a microassembly of heterogeneous materials.
A method for microassembly of heterogeneous materials, the method comprising:
- fabricating a solid-phase ink comprising SiO2 on a donor substrate wherein the fabricating comprises:
- growing a SiO2 layer on a silicon layer;
- patterning the SiO2 layer to form a SiO2 ink pattern on the silicon layer;
- patterning the silicon layer to form a silicon pattern laterally surrounding and underlying the SiO2 ink pattern, thereby exposing a buried oxide layer away from the SiO2 ink pattern;
- covering the SiO2 ink pattern with photoresist and forming one or more photoresist anchors to the buried oxide layer;
- and
- removing the silicon pattern, thereby forming the solid-phase ink comprising SiO2 for transfer printing;
- contacting a stamp with the solid-phase ink disposed on the donor substrate to form an inked stamp, where the solid-phase ink is reversibly bound to the stamp;
- stamping the inked stamp onto a receiving substrate or onto an object on the receiving substrate, wherein the receiving substrate or the object comprises a material different from the SiO2;
- removing the stamp, thereby transferring the solid-phase ink to the receiving substrate;
- and
- thermally joining the solid-phase ink with the receiving substrate or the object, thereby forming a microassembly of heterogeneous materials.
Dependencies are inferred from the claim text.