Resin molded product, electronic device, mold, method for manufacturing mold and method for manufacturing resin molded product
AssigneeCanon Kabushiki Kaisha
InventorKei Oikawa
Life of this patent
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Abstract
There is provided a resin molded product including a hairline pattern having small roughness and high gloss. The resin molded product includes a surface having a hairline pattern in which a plurality of ridges extending in an X direction is arranged in a Y direction, thus the plurality of ridges includes a plurality of first ridges and a plurality of second ridges higher than the first ridges, with the hairline pattern having a maximum height Ry of 6 [μm] or less in the X direction, and an arithmetic average curvature Spc of apex points of 625 [1/mm] or less.
Claims7
A resin molded product comprising a surface having a hairline pattern in which a plurality of ridges extending in one direction is arranged in a width direction orthogonal to the one direction,
- wherein the plurality of ridges includes a plurality of first ridges and a plurality of second ridges higher than the first ridges, and
- wherein the hairline pattern has a maximum height Ry of 6 [μm] or less in the one direction, and has an arithmetic average curvature Spc of apex points of 625 [1/mm] or lower.
An electronic device comprising an exterior member comprising a surface having a hairline pattern in which a plurality of ridges extending in one direction is arranged in a width direction orthogonal to the one direction,
- wherein the plurality of ridges includes a plurality of first ridges and a plurality of second ridges higher than the first ridges, and
- wherein the hairline pattern has a maximum height Ry of 6 [μm] or less in the one direction, and has an arithmetic average curvature Spc of apex points of 625 [1/mm] or lower.
Dependencies are inferred from the claim text.