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US 10,793,745 B2Granted
Dual-cure resins and related methods
AssigneeFormlabs, Inc.
InventorsEric Arndt, Gayla Lyon, Zachary Zguris
Life of this patent
Estimating the term…
Abstract
The present disclosure relates generally to curable resins, in particular dual-cure resins, and related methods for use in an additive fabrication (e.g., 3-dimensional printing) device.
Claims21
A dual-cure resin for use in additive manufacturing, comprising:
- a photo-curable component configured to cure when subjected to an effective amount of actinic radiation;
- and
- a secondary component comprising a first secondary precursor species isolated from a second secondary precursor species, the first secondary precursor species and the second secondary precursor species configured to react when subjected to an initiating event.
A dual-cure resin for use in additive manufacturing, comprising:
- a photo-curable component configured to cure when subjected to an effective amount of actinic radiation;
- and
- a secondary component comprising dicyandiamide and a secondary precursor species configured to react with dicyandiamide when subject to an initiating event.
A dual-cure resin for use in additive manufacturing, comprising:
- a photo-curable component configured to cure when subjected to an effective amount of actinic radiation;
- and
- a secondary component comprising a plurality of particles comprising a first secondary precursor species, wherein the plurality of particles are configured to dissolve when subjected to a dissolving event.
Dependencies are inferred from the claim text.