Printed circuit board and sensor
AssigneeVitesco Technologies GmbH
InventorsErich Mattmann, Robert Peter, Waldemar Brinkis, Martin Maasz, Burkhard Dasbach
Life of this patent
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Abstract
A printed circuit board having conductor tracks formed on one side of a substrate. The substrate is able to be cohesively bonded at a contact face to a cover for protecting the conductor tracks. In this case, the substrate includes a step, which forms a barrier with respect to an auxiliary material for promoting the cohesive bond, in order to prevent any wetting of the conductor tracks with the auxiliary material. A sensor having a printed circuit board for use in a fuel filling level measurement system of a vehicle.
Claims20
A printed circuit board comprising:
- a cover;
- a planar substrate bonded by a cohesive bond made by soldering at a contact face on a planar surface of the planar substrate to the cover;
- conductor tracks formed on the surface side of the planar substrate, the conductor tracks arranged inboard of and protected by the cover;
- an auxiliary material comprising flux configured to promote the cohesive bond;
- and
- a step, configured as a positive step, arranged on the planar surface of the planar substrate that extends away from the planar surface of the planar substrate and configured to form a barrier with respect to the auxiliary material for promoting the cohesive bond to prevent any wetting of the conductor tracks with the auxiliary material,
- wherein the cover does not bear on the barrier.
A printed circuit board comprising:
- a cover;
- a planar substrate bonded by a cohesive bond at a contact face to the cover;
- conductor tracks formed on one side of the planar substrate, the conductor tracks protected by the cover;
- an auxiliary material for promoting the cohesive bond;
- and
- a step, configured as a positive step, arranged on the planar substrate that extends away from a planar surface of the planar substrate and configured to form a barrier with respect to the auxiliary material for promoting the cohesive bond to prevent any wetting of the conductor tracks with the auxiliary material,
- wherein the step contains metal.
A printed circuit board, comprising:
- a cover;
- a planar substrate bonded by a cohesive bond at a contact face to the cover;
- conductor tracks formed on one side of the planar substrate, the conductor tracks protected by the cover;
- an auxiliary material for promoting the cohesive bond;
- a step, configured as a positive step, arranged on the planar substrate radially inside a mounting portion of the cover, which extends away from a planar surface of the planar substrate and configured to form a barrier with respect to the auxiliary material for promoting the cohesive bond to prevent any wetting of the conductor tracks with the auxiliary material;
- and
- a solder seal that is at least partially radially outside the mounting portion of the cover.
A printed circuit board, comprising:
- a cover;
- a planar substrate bonded by a cohesive bond made by soldering at a contact face on a planar surface of the planar substrate to the cover;
- conductor tracks formed on the surface side of the planar substrate, the conductor tracks arranged inboard of and protected by the cover;
- an auxiliary material comprising flux configured to promote the cohesive bond;
- a step, configured as a positive step, arranged on the planar surface of the planar substrate that extends away from the planar surface of the planar substrate and configured to form a barrier with respect to the auxiliary material for promoting the cohesive bond to prevent any wetting of the conductor tracks with the auxiliary material;
- and
- a perimeter conductor track arranged at an edge of the planar surface the planar substrate at which the cover is located,
- wherein a portion of the cover that contacts the perimeter conductor track is convex.
Dependencies are inferred from the claim text.