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US 10,791,624 B2Granted
Resin composition and film using same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTomoaki Sawada, Takatoshi Abe, Shingo Yoshioka
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Abstract
The present invention is a resin composition characterized by being able to undergo elastic deformation, having little residual strain rate and exhibiting stress relaxation properties. More specifically, the present invention relates to a resin composition wherein the stress relaxation rate (R) and the residual strain rate (α), as measured in a prescribed extension-restoration test, are as follows: 20%≤R≤95% and 0%≤α≤3%.
Claims9
A thermosetting resin composition,
- wherein the resin composition contains at least
- (A) a polyrotaxane,
- (B) an epoxy resin which contains 2 or more epoxy groups and 3 or more methyl groups per molecule and which has a molecular weight of 500 or higher and
- (C) a curing agent;
- and
- wherein the proportion of epoxy resin is 30 to 50 parts by mass with respect to 100 parts by mass of polyrotaxane, epoxy resin and curing agent.
3 more elements
Dependencies are inferred from the claim text.