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US 10,784,191 B2Granted
Interface structures and methods for forming same
AssigneeInvensas Bonding Technologies, Inc.
InventorsShaowu Huang, Belgacem Haba, Javier A. DeLaCruz
Life of this patent
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Abstract
A stacked and electrically interconnected structure is disclosed. The structure can comprise a first element and a second element directly bonded to the first element along a bonding interface without an intervening adhesive. A filter circuit can be integrally formed between the first and second elements along the bonding interface.
Claims24
A stacked and electrically interconnected structure comprising:
- a first element comprising a first non-conductive feature;
- and
- a second element comprising a second non-conductive feature, the second non-conductive feature directly bonded to the first non-conductive feature of the first element along a bonding interface without an intervening adhesive,
- wherein a filter circuit is integrally formed vertically between the first and second elements along the bonding interface.
1 more element
A stacked and electrically interconnected structure comprising:
- a first element comprising a first non-conductive feature;
- and
- a second element comprising a second non-conductive feature, the second non-conductive feature directly bonded to the first non-conductive feature of the first element;
- and
- an interface structure disposed vertically between the first and second elements, the interface structure mechanically and electrically connecting the first and second elements, the interface structure comprising a filter circuit integrated within the interface structure, the filter circuit configured to pass electrical signals at a first range of frequencies and to attenuate electrical signals at a second range of frequencies.
2 more elements
A stacked and electrically interconnected structure comprising:
- a first element comprising a first non-conductive feature;
- and
- a second element comprising a second non-conductive feature, the second non-conductive feature directly bonded to the first non-conductive feature of the first element;
- and
- an interface structure disposed vertically between the first and second elements, the interface structure mechanically and electrically connecting the first and second elements, the interface structure comprising an inductive electrical pathway between the first element and the second element and a capacitive electrical pathway between the first element and the second element.
2 more elements
Dependencies are inferred from the claim text.