Printable component structure with electrical contact

A micro-transfer printed structure, comprising:

• a destination substrate and one or more backplane electrical contacts;
• and
• one or more micro-transfer printed components, each of the one or more micro-transfer printed components comprising:
• a semiconductor device with a top side and a bottom side, wherein the semiconductor device comprises an integrated circuit;
• one or more top electrical contacts disposed on the top side of the semiconductor device;
• one or more bottom electrical contacts exposed on the bottom side of the semiconductor device, wherein the one or more bottom electrical contacts are physically separate from the one or more top electrical contacts and electrically connected to the one or more top electrical contacts through the integrated circuit;
• and
• one or more electrically conductive spikes disposed on, in electrical contact with, and protruding from the one or more top electrical contacts in a direction away from the destination substrate, forming an exposed electrical contact on a side of the micro-transfer printed component opposite the destination substrate,
• wherein the backplane electrical contacts are electrically connected to the one or more bottom electrical contacts of each of the one or more micro-transfer printed components.

A method of making a micro-transfer printed structure, comprising:

• providing one or more micro-transfer printable component structures on a source substrate, each of the one or more micro-transfer printable component structures comprises:
• a semiconductor device with a top side and a bottom side, wherein the semiconductor device comprises an integrated circuit,
• one or more top electrical contacts disposed on the top side of the semiconductor device,
• one or more bottom electrical contacts exposed on the bottom side of the semiconductor device, the one or more bottom electrical contacts are physically separate from the one or more top electrical contacts and electrically connected to the one or more top electrical contacts through the integrated circuit, and
• one or more electrically conductive spikes disposed on, in electrical contact with, and protruding from the one or more top electrical contacts in a direction away from the source substrate, forming an exposed electrical contact on a side of the micro-transfer printable component opposite the source substrate;
• providing a destination substrate having one or more backplane electrical contacts;
• micro transfer printing the one or more micro-transfer printable component structures from the source substrate onto the destination substrate;
• disposing an insulator over at least a portion of each of the one or more micro-transfer printable component structures;
• and
• disposing a conductor over at least a portion of the insulator and over at least a portion of the one or more spikes of each of the one or more micro-transfer printable components so that the conductor is in electrical contact with the one or more spikes of each of the one or more micro-transfer printable component structures.