Package structure and method of manufacturing the same

A package structure, comprising:

• a plurality of sub-package structures having antenna elements, wherein one of the antenna elements comprises a conductive feature and a first encapsulant encapsulating sidewalls of the conductive feature,
• a second encapsulant, encapsulating sidewalls of the sub-package structures, wherein a top surface of the second encapsulant is coplanar with a top surface of the antenna element;
• a RDL structure on the sub-package structures and on the second encapsulant, electrically connected to the plurality of sub-package structures;
• and
• a conductive terminal, electrically connected to the sub-package structures through the RDL structure,
• wherein the first encapsulant comprises a first base material and first fillers;
• the second encapsulant comprises a second base material and second fillers;
• and one of the first fillers contacting with the second encapsulant has a flat surface.

A method of forming a package structure, comprising:

• performing a first integrated fan-out (InFO) process to form a plurality of sub-package structures, comprising:
• forming a first TIV aside a die on a first RDL structure;
• forming a first encapsulant, encapsulating sidewalls of the TIV and sidewalls of the die;
• forming an antenna element on the die, the first TIV and the first encapsulant;
• and
• performing a second InFO process to pack the sub-package structures into the package structure, comprising:
• forming a second encapsulant, encapsulating sidewalls of the sub-package structures;
• forming a second RDL structure, and electrically connecting the second RDL structure to the sub-package structures;
• and
• forming a conductive terminal, electrically connected to the sub-package structures through the second RDL structure.