Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsJun Yamawaku, Chishio Koshimizu
Life of this patent
Estimating the term…
Abstract
There is provided a focus ring that is capable of preventing deposits from adhering to a member having a lower temperature in a gap between two members having different temperatures. A focus ring 25 is disposed to surround a peripheral portion of a wafer W in a chamber 11 of a substrate processing apparatus 10. The focus ring 25 includes an inner focus ring 25a and an outer focus ring 25b. Here, the inner focus ring 25a is placed adjacent to the wafer W and configured to be cooled; and the outer focus ring 25b is placed so as to surround the inner focus ring 25a and configured not to be cooled. Further, a block member 25c is provided in a gap between the inner focus ring 25a and the outer focus ring 25b.
Claims19
A substrate processing apparatus comprising:
- a processing chamber for accommodating a substrate therein;
- a focus ring disposed to surround a peripheral portion of the substrate disposed in the processing chamber;
- a mounting table for mounting thereon the substrate and the focus ring;
- and
- a pusher pin configured to protrude from the mounting table,
- wherein the focus ring comprises:
- an inner focus ring placed adjacent to the substrate;
- and
- an outer focus ring placed so as to surround the inner focus ring,
- wherein the pusher pin is configured to lift up the inner focus ring away from the outer focus ring until a bottom surface of the inner focus ring is positioned higher than a top surface of the outer focus ring.
A substrate processing apparatus comprising:
- a processing chamber;
- a susceptor including a step-shaped portion at a periphery of a top portion of the susceptor, the step-shaped portion having a lower tread, an upper tread and a riser between the lower tread and the upper tread;
- an inner focus ring placed on the lower tread of the step-shaped portion;
- an outer focus ring placed to surround the inner focus ring;
- a lift unit configured to protrude from the lower tread of the step-shaped portion and to lift up the inner focus ring;
- and
- wherein a part of the inner focus ring and a part of the outer focus ring overlap each other when viewed from above.
A plasma processing apparatus comprising:
- a processing chamber;
- a susceptor disposed in the processing chamber and including a step-shaped portion at a periphery of a top portion of the susceptor, the step-shaped portion having a lower tread, an upper tread, and a riser between the lower tread and the upper tread;
- a side protection member disposed to surround an outer periphery of the susceptor;
- an inner focus ring disposed adjacent to an outer periphery of the susceptor;
- an outer focus ring disposed to surround the inner focus ring;
- and
- a lifter configured to protrude from the lower tread and to lower and raise the inner focus ring between a lowered position and a raised position,
- wherein an inner periphery of the inner focus ring and a part of the susceptor overlap each other when viewed from above,
- a part of the inner focus ring and a part of the outer focus ring overlap each other when viewed from above,
- at least a part of a bottom surface of the outer focus ring is mounted on a top surface of the side protection member, and
- an outer periphery portion of a top surface of the outer focus ring is exposed to a processing space in the processing chamber.
Dependencies are inferred from the claim text.