Back to results
US 10,773,412 B2Granted
Profiling saw blade and method of using
AssigneeNorbord Inc.
InventorStephen B. Bailey
Life of this patent
Estimating the term…
Abstract
The present invention provides an apparatus and method for cutting a chamfer into the edge of a material while simultaneously making another cut in the material. The chamfer provides the cut material with reduced susceptibility to top surface edge swell.
Claims11
A circular saw blade comprising:
- a plurality of cutting heads approximately evenly distributed around a circumference of the circular blade, at least some of the cutting heads being replaceable, each cutting head comprising
- a first cutting surface comprising a linear surface comprising a groove shape thereon which generates a tongue upon rotation of the circular blade about a central axis, and
- a second cutting surface substantially perpendicular to the first cutting surface, wherein the second cutting surface extends outward from the circumference of the circular blade and outward from the first cutting surface, the second cutting surface comprising a linear gradient which generates a chamfer cut upon rotation of the circular blade about a central axis.
A circular saw blade comprising:
- a plurality of cutting heads approximately evenly distributed around a circumference of the circular blade, at least some of the cutting heads being replaceable, each cutting head comprising:
- a first cutting surface comprising a linear surface comprising a tongue shape thereon which generates a groove cut upon rotation of the circular blade about a central axis, and
- a second cutting surface substantially perpendicular to the first cutting surface, wherein the second cutting surface extends outward from the circumference of the circular blade and outward from the first cutting surface, the second cutting surface comprising a linear gradient which generates a chamfer cut upon rotation of the circular blade about a central axis.
Dependencies are inferred from the claim text.