Process for depositing dry powder particles onto a substrate and adhesively bonding the particles to the substrate

A method for adhesively bonding flowable dry powder particles to a moving substrate, the method comprising:

• dispersing flowable dry powder particles onto a major radially inner surface of a hollow, rotating stencil roll,
• contacting a pressure-sensitive adhesive major surface of a moving substrate with a major radially outer surface of the hollow, rotating stencil roll and temporarily adhesively attaching the pressure-sensitive adhesive major surface of the moving substrate to the major radially outer surface of the hollow, rotating stencil roll;
• as the substrate rotates with the stencil roll, allowing at least some flowable dry powder particles to pass through at least some apertures in the stencil roll so as to contact the pressure-sensitive adhesive major surface of the moving substrate and to be adhesively bonded thereto;
• and, allowing at least some flowable dry powder particles that have not adhesively bonded to the pressure-sensitive adhesive surface of the moving substrate to tumble freely along the major radially inner surface of the stencil roll as the stencil roll rotates;
• and,
• detaching the pressure-sensitive adhesive surface of the moving substrate from the outer surface of the hollow, rotating stencil roll so as to produce a substrate comprising an array of flowable dry powder particles attached to the pressure-sensitive adhesive major surface thereof,
• wherein the flowable dry powder particles consist of inorganic particles.