# US 10,772,245 B2 · Systems and methods for thermal management for high power density EMI shielded electronic devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,245 B2 - Document ID: US10772245B2 - Status: Granted - Kind: B2 - Application number: 15/472,596 - Filed: 2017-03-29 - Published: 2017-10-05 - Granted: 2020-09-08 - Earliest claimed: 2016-04-04 - Assignees: CommScope Technologies LLC - Applicants: CommScope Technologies LLC - Inventors: Kevin Craig - Web page: https://patentgrep.com/patent/US10772245B2 ## CPC - H05K 9/0032: {having multiple parts, e.g. frames mating with lids} - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H05K 1/0216: {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215)} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H05K 7/20445: {the coupling element being an additional piece, e.g. thermal standoff} - H10W 40/037: {Assembling together parts thereof} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/611: {Bolts or screws} - H10W 40/70: Fillings or auxiliary members in containers or in encapsulations for thermal protection or control - H10W 40/77: Auxiliary members characterised by their shape - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips} - H10W 72/071: {Connecting or disconnecting} - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - H05K 1/181: associated with surface mounted components - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/10265: Metallic coils or springs, e.g. as part of a connection element - H05K 2201/10371: Shields or metal cases - H05K 2201/10409: Screws - H05K 2201/10522: Adjacent components - H05K 2201/10674: Flip chip - H05K 2201/10734: Ball grid array [BGA]; Bump grid array - H10W 40/235: {attached to package parts} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 76/15: Containers comprising an insulating or insulated base - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit. ## Claims ### Claim 1 An electronic module, the module comprising: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; and a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence in order to inhibit EMI transmissions; and wherein the heatsink EMI shield lid comprises a spring loaded thermal interface configured to maintain a spring loaded force on, and in conductive thermal contact with, the at least one integrated circuit; wherein the heatsink EMI shield lid comprises: an EMI shield lid member having a first surface that interfaces with the at least one EMI shield fence and an opposing second surface comprising a plurality of heatsink fins; wherein the first surface that interfaces with the at least one EMI shield fence comprises at least one groove aligned with the EMI shield fence, wherein the at least one EMI shield fence is at least partially inserted into the at least one groove. ### Claim 2 (depends on 1) The module of claim 1, wherein the EMI shield lid member comprises one or more compression stop standoffs extending from the first surface, wherein the one or more compression stop standoffs have a calibrated length that limits compression of the spring loaded thermal interface. ### Claim 3 (depends on 2) The module of claim 2, wherein the EMI shield lid member is mounted to the circuit board by one or more fasteners that penetrate through the circuit board and into the one or more compression stop standoffs. ### Claim 4 (depends on 1) The module of claim 1, further comprising a spring feature positioned at an interface between the at least one EMI shield fence and the EMI shield lid member. ### Claim 5 (depends on 1) The module of claim 1, wherein the spring loaded thermal interface comprises a heat spreader coupled to a thermal gap pad, wherein the thermal gap pad is coupled to the first surface of the EMI shield lid and the heat spreader is conductively thermally coupled to an active region of the at least one integrated circuit. ### Claim 6 (depends on 5) The module of claim 5, wherein the heat spreader comprises a copper slug. ### Claim 7 (depends on 5) The module of claim 5, wherein the heat spreader has a surface area greater than a surface area of the active region of the at least one integrated circuit. ### Claim 8 (depends on 5) The module of claim 5, wherein the heat spreader is conductively thermally coupled to the active region of the at least one integrated circuit through a thermal interface material. ### Claim 9 (depends on 1) The module of claim 1, wherein the at least one integrated circuit comprises a flip-chip architecture and is coupled to the circuit board by a ball-grid-array (BGA) mounting technology. ### Claim 10 (depends on 1) The module of claim 1, wherein the at least one integrated circuit comprises a system-on-chip device. ### Claim 11 An electronic module, the module comprising: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; and a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence in order to inhibit EMI transmissions; and wherein the heatsink EMI shield lid comprises a spring loaded thermal interface configured to maintain a spring loaded force on, and in conductive thermal contact with, the at least one integrated circuit; wherein the at least one integrated circuit comprises a radio frequency signal processing device and the electronic module is a radio module. ### Claim 12 (depends on 1) The module of claim 1, wherein two or more electronic devices are both thermally coupled to the heatsink EMI shield lid by the spring loaded thermal interface. ### Claim 13 (depends on 1) The module of claim 1, wherein a first electronic device is thermally coupled to the heatsink EMI shield lid by a first spring loaded thermal interface, and a second electronic devices is thermally coupled to the heatsink EMI shield lid by a second spring loaded thermal interface. ### Claim 14 An electronic module, the module comprising: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; and a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence in order to inhibit EMI transmissions; and wherein the heatsink EMI shield lid comprises a spring loaded thermal interface configured to maintain a spring loaded force on, and in conductive thermal contact with, the at least one integrated circuit; wherein the module is a component of one of: a wireless network access point; a cellular base station; and a distributed antenna system. ### Claim 15 A thermal and electro-magnetic interference (EMI) management system for an integrated circuit device, the system comprising: at least one electro-magnetic interference (EMI) shield fence, wherein the integrated circuit device is mounted to a substrate within a perimeter defined by the EMI shield fence; and an heatsink EMI shield lid that secures onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence in order to inhibit EMI transmissions; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface configured to maintain a spring loaded force on, and in conductive thermal contact with, the at least one integrated circuit; wherein the heatsink EMI shield lid comprises: an EMI shield lid member having a first surface that interfaces with the at least one EMI shield fence and an opposing second surface comprising a plurality of heatsink fins; wherein the EMI shield lid member is mounted to the substrate by one or more fasteners that penetrate through the substrate and into the one or more compression stop standoffs. ### Claim 16 (depends on 15) The system of claim 15, wherein the substrate comprises a circuit board. ### Claim 17 (depends on 15) The system of claim 15, wherein the EMI shield lid member comprises one or more compression stop standoffs extending from the first surface, wherein the one or more compression stop standoffs have a calibrated length that limits compression of the spring loaded thermal interface. ### Claim 18 A thermal and electro-magnetic interference (EMI) management system for an integrated circuit device, the system comprising: at least one electro-magnetic interference (EMI) shield fence, wherein the integrated circuit device is mounted to a substrate within a perimeter defined by the EMI shield fence; and an heatsink EMI shield lid that secures onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence in order to inhibit EMI transmissions; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface configured to maintain a spring loaded force on, and in conductive thermal contact with, the at least one integrated circuit; wherein the heatsink EMI shield lid comprises: an EMI shield lid member having a first surface that interfaces with the at least one EMI shield fence and an opposing second surface comprising a plurality of heatsink fins; wherein the first surface that interfaces with the at least one EMI shield fence comprises at least one groove aligned with the at least one EMI shield fence, wherein the at least one EMI shield fence is at least partially inserted into the at least one groove. ### Claim 19 (depends on 15) The system of claim 15, wherein the spring loaded thermal interface comprises a heat spreader coupled to a thermal gap pad, wherein the thermal gap pad is coupled to the first surface of the EMI shield lid; and wherein the heat spreader is configured to conductively thermally coupled to an active region of the integrated circuit. ### Claim 20 (depends on 19) The system of claim 19, wherein the heat spreader comprises a copper slug. ### Claim 21 (depends on 19) The system of claim 19, wherein the heat spreader has a surface area greater than a surface area of the active region of the at least one integrated circuit. ### Claim 22 (depends on 19) The system of claim 19, further comprising a thermal interface material positioned between the heat spreader and the active region of the integrated circuit. ### Claim 23 A method for thermal and electro-magnetic interference (EMI) management for an integrated circuit device, the method comprising: surrounding one or more integrated circuit devices within a perimeter defined by at least one electro-magnetic interference (EMI) shield fence; securing a heatsink EMI shield lid onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence in order to inhibit EMI transmissions, wherein the heatsink EMI shield lid comprise a spring loaded thermal interface; and applying the spring loaded thermal interface against the one or more integrated circuit devices, wherein the spring loaded thermal interface is in conductive thermal contact with the one or more integrated circuit devices, and configured to maintain the spring loaded force on the one or more integrated circuit devices wherein the heatsink EMI shield lid comprises: an EMI shield lid member having a first surface that interfaces with the at least one EMI shield fence and an opposing second surface comprising a plurality of heatsink fins; wherein the first surface that interfaces with the at least one EMI shield fence comprises at least one groove aligned with the EMI shield fence, wherein the at least one EMI shield fence is at least partially inserted into the at least one groove. ### Claim 24 (depends on 23) The method of claim 23, wherein the EMI shield lid member comprises one or more compression stop standoffs extending from the first surface, wherein the one or more compression stop standoffs have a calibrated length that limits compression of the spring loaded thermal interface. ### Claim 25 (depends on 23) The method of claim 23, wherein the spring loaded thermal interface comprises a heat spreader coupled to a thermal gap pad, the method further comprising: conductively thermal coupling the thermal gap pad to the first surface of the EMI shield lid; and conductively thermal coupling the heat spreader to an active region of the at least one integrated circuit. ### Claim 26 (depends on 25) The method of claim 25, wherein the heat spreader comprises a copper slug. Reconsideration and withdrawal of these rejections are respectfully requested. ### Claim 27 (depends on 25) The method of claim 25, wherein the heat spreader has a surface area greater than a surface area of the active region of the at least one integrated circuit. ### Claim 28 (depends on 25) The method of claim 25, wherein the heat spreader is conductively thermally coupled to the active region of the at least one integrated circuit through a thermal interface material.