# US 10,772,244 B2 · High-frequency module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,244 B2 - Document ID: US10772244B2 - Status: Granted - Kind: B2 - Application number: 15/809,236 - Filed: 2017-11-10 - Published: 2018-03-29 - Granted: 2020-09-08 - Earliest claimed: 2015-05-11 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yoshihito Otsubo; Issei Yamamoto - Web page: https://patentgrep.com/patent/US10772244B2 ## CPC - H05K 9/0024: {Shield cases mounted on a PCB, e.g. cans or caps or conformal shields} - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 1/181: associated with surface mounted components - H05K 5/065: {sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H10W 76/42: Fillings - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/10318: Surface mounted metallic pins - H05K 2201/10522: Adjacent components - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 70/685: comprising multiple insulating layers - H10W 72/07236: {Soldering or alloying} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/00: Package configurations - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract The characteristics of a shield wall that prevents the mutual interference of the noise between components are improved by lowering the resistance of the shield wall. A high-frequency module 1a includes a wiring board 2, a plurality of components 3a to 3e mounted on an upper surface 2a of the wiring board 2, a sealing resin layer 4 stacked on the upper surface 2a of the wiring board 2 to seal the components 3a to 3e, and a shield wall 5 disposed between the adjacent components in the sealing resin layer 4. A part of the shield wall 5 is constituted of metal pins 5a standing on the upper surface 2a of the wiring board 2. ## Claims ### Claim 1 A high-frequency module comprising: a wiring board; a plurality of components mounted on a principal surface of the wiring board; a sealing resin layer stacked on the principal surface of the wiring board to seal the plurality of components; and a shield wall disposed between one or more predetermined components and another one or more components among the plurality of components inside the sealing resin layer, wherein the shield wall has at least one metal pin standing on the principal surface of the wiring board, an upper end of the at least one metal pin is exposed from an opposite surface of the sealing resin layer to a surface of the sealing resin layer facing the principal surface of the wiring board, wherein the shield wall has a metal film filling a groove provided in the sealing resin layer, and a side surface of the metal film is in contact with a side surface of the at least one metal pin, the side surface of the at least one metal pin is connected to the upper end and a lower end of the at least one metal pin, a height of the metal pin is higher than a height of each of said plurality of components. ### Claim 2 (depends on 1) The high-frequency module according to claim 1, wherein the shield wall is line-shaped in a plan view of the wiring board, and the line has a bent portion, and wherein the least one metal pin is disposed in the bent portion. ### Claim 3 (depends on 2) The high-frequency module according to claim 2, wherein the shield wall includes a first linear portion having a first width and a second linear portion having a second width different from the first width in a plan view of the wiring board, and wherein a contact point between the first linear portion and the second linear portion is the bent portion. ### Claim 4 (depends on 2) The high-frequency module according to claim 2, wherein one end of the least one metal pin is coupled to a land electrode provided on the principal surface of the wiring board, and wherein the land electrode is coupled to a ground electrode provided in the wiring board. ### Claim 5 (depends on 1) The high-frequency module according to claim 1, wherein one end of the least one metal pin is coupled to a land electrode provided on the principal surface of the wiring board, and wherein the land electrode is coupled to a ground electrode provided in the wiring board. ### Claim 6 (depends on 1) The high-frequency module according to claim 1, wherein a purity of a metal in the metal film is lower than a purity of a metal in the least one metal pin. ### Claim 7 (depends on 6) The high-frequency module according to claim 6, wherein the sealing resin layer is disposed between the metal film and the wiring board. ### Claim 8 (depends on 1) The high-frequency module according to claim 1, wherein the sealing resin layer is disposed between the metal film and the wiring board. ### Claim 9 (depends on 1) The high-frequency module according to claim 1, wherein the least one metal pin of the shield wall includes a plurality of metal pins, and the shield wall is line-shaped in a plan view of the wiring board, and wherein the plurality of metal pins are arranged along the line defined by the shield wall in a plan view of the wiring board. ### Claim 10 (depends on 9) The high-frequency module according to claim 9, wherein the plurality of metal pins include a plurality of first metal pins and a plurality of second metal pins, wherein a connecting line connecting center points of the plurality of first metal pins is substantially parallel to the line defined by the shield wall in a plan view of the wiring board, and wherein centers of the plurality of second metal pins are not aligned with the connecting line and are each disposed between one of the first metal pins and an adjacent one of the first metal pins in a plan view of the wiring board. ### Claim 11 (depends on 10) The high-frequency module according to claim 10, wherein a cross-sectional area of the second metal pins along a direction parallel to the principal surface of the wiring board is smaller than a cross-sectional area of the first metal pins along the direction parallel to the principal surface of the wiring board. ### Claim 12 (depends on 10) The high-frequency module according to claim 10, wherein the line of the shield wall defined in a plan view of the wiring board has a bent portion or a curved portion. ### Claim 13 (depends on 9) The high-frequency module according to claim 9, wherein the line of the shield wall defined in a plan view of the wiring board has a bent portion or a curved portion. ### Claim 14 A high-frequency module comprising: a wiring board; a component mounted on a principal surface of the wiring board; a sealing resin layer stacked on the principal surface of the wiring board to seal the component; and a shield layer covering at least a part of a surface of the sealing resin layer, wherein the shield layer has a plurality of metal pins arranged on a side surface of the sealing resin layer, an upper end of each of the plurality of metal pins is exposed from an opposite surface of the sealing resin layer to a surface of the sealing resin layer facing the principal surface of the wiring board, wherein the shield wall has a metal film filling a groove provided in the sealing resin layer, and a side surface of the metal film is in contact with a side surface of the at least one metal pin, the side surface of the at least one metal pin is connected to the upper end and a lower end of the at least one metal pin, a height of the metal pin is higher than a height of each of said plurality of components. ### Claim 15 (depends on 14) The high-frequency module according to claim 14, wherein surfaces of the metal pins each have an anticorrosion film. ### Claim 16 (depends on 14) The high-frequency module according to claim 14, wherein the plurality of metal pins are arranged along a peripheral edge of the principal surface of the wiring board to surround the principal surface. ### Claim 17 (depends on 16) The high-frequency module according to claim 16, wherein the principal surface of the wiring board is rectangular, wherein the plurality of metal pins have respective linear portions in cross sections along a direction parallel to the principal surface of the wiring board, and wherein the linear portions in the plurality of metal pins are disposed to overlap with a part of a peripheral edge of the principal surface of the wiring board in a plan view of the wiring board.