# US 10,772,236 B2 · Heat dissipation device and method, and electronic device

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- Number: US 10,772,236 B2
- Document ID: US10772236B2
- Status: Granted
- Kind: B2
- Application number: 16/452,886
- Filed: 2019-06-26
- Published: 2019-12-26
- Granted: 2020-09-08
- Earliest claimed: 2018-06-26
- Assignees: Lenovo (Beijing) Limited
- Applicants: Lenovo (Beijing) Co., Ltd.
- Inventors: Guowen Zhang
- Web page: https://patentgrep.com/patent/US10772236B2

## CPC

- H05K 7/2039: {characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00)}
- F28F 13/00: Arrangements for modifying heat-transfer, e.g. increasing, decreasing (F28F1/00 - F28F11/00 take precedence)
- G06F 1/203: {for portable computers, e.g. for laptops}
- H05K 5/03: Covers
- H05K 7/2029: {using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954)}
- H05K 7/20454: {with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste}
- H05K 7/2049: {Pressing means used to urge contact, e.g. springs}
- H10W 40/735: {by melting or evaporation of solids}
- F28F 2013/005: {Thermal joints}
- F28F 2255/02: Flexible elements
- F28F 2255/04: comprising shape memory alloys or bimetallic elements
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.

## Claims

### Claim 1

A heat dissipation device, comprising:
a heat conducting cover configured to be disposed in an electronic device, the heat conducting cover forming a closed cavity accommodating a heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature decreases to a second threshold;
a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
wherein, in response to a temperature increase, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the heating element.

### Claim 2 (depends on 1)

The heat dissipation device according to claim 1, wherein:
in response to the heat conducting cover being in the first shape, the heat absorbing material filler does not a contact the heating element of the electronic device; and
in response to the heat conducting cover being in the second shape, the heat absorbing material filler contacts the heating element.

### Claim 3 (depends on 2)

The heat dissipation device according to claim 2, wherein:
in response to that the heat conducting cover is in the first shape, the heat conducting cover is in contact with a housing of the electronic device, and
in response to that the heat conducting cover is in the second shape, there is a gap between the heat conducting cover and the housing of the electronic device.

### Claim 4 (depends on 3)

The heat dissipation device according to claim 3, wherein: the first shape is a hollow concave shape, and a concave surface of the heat conducting cover faces the housing of the electronic device; the heating element is located at an intermediate position of the closed cavity of the heat conducting cover, and the heat absorbing material filler is located at both ends of the concave cavity of the heat conducting cover; and the second shape is a hollow rectangular shape, and the heat absorbing material filler is able to fill the closed cavity of the heat conducting cover.

### Claim 5 (depends on 3)

The heat dissipation device according to claim 3, wherein: the heat absorbing material filler is a phase-change-energy-storage material filler; both a phase change temperature of the phase-change-energy-storage material filler and a deformation temperature of the heat conducting cover are greater than a high-power housing temperature of the electronic device, and the phase change temperature is not less than the deformation temperature; and the high-power housing temperature is a temperature of the housing of the electronic device when an operating power consumption of the electronic device is greater than a power consumption threshold.

### Claim 6 (depends on 2)

The heat dissipation device according to claim 2, wherein:
in response to that the heat conducting cover is in the first shape, the heat conducting cover is in contact with the heating element, and
in response to that the heat conducting cover is in the second shape, there is a gap between the heat conducting cover and the heating element.

### Claim 7

An electronic device, comprising:
a housing;
a heating element disposed within the housing; and
a heat dissipation device disposed in the housing, wherein the heat dissipation device comprises:
a heat conducting cover disposed on the heating element, the heat conducting cover forming a closed cavity accommodating the heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature of the electronic device increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature of the electronic device decreases to a second threshold; and
a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
wherein, in response to an increase in temperature of the heating element, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the heating element.

### Claim 8 (depends on 7)

The electronic device according to claim 7, wherein:
in response to the heat conducting cover being in the first shape, the heat absorbing material filler does contact to the heating element; and
in response to the heat conducting cover being in the second shape, the heat absorbing material filler contacts the heating element.

### Claim 9 (depends on 8)

The electronic device according to claim 8, wherein:
in response to that the heat conducting cover is in the first shape, the heat conducting cover is in contact with the housing of the electronic device, and
in response to that the heat conducting cover is in the second shape, there is a gap between the heat conducting cover and the housing of the electronic device.

### Claim 10 (depends on 9)

The electronic device according to claim 9, wherein: the first shape is a hollow concave shape, and a concave surface of the heat conducting cover faces the housing of the electronic device; the heating element is located at an intermediate position of the closed cavity of the heat conducting cover, and the heat absorbing material filler are located at both ends of the concave cavity of the heat conducting cover; and the second shape is a hollow rectangular shape, and the heat absorbing material filler is able to fill the closed cavity of the heat conducting cover.

### Claim 11 (depends on 8)

The electronic device according to claim 8, wherein:
in response to that the heat conducting cover is in the first shape, the heat conducting cover is in contact with the heating element, and
in response to that the heat conducting cover is in the second shape, there is a gap between the heat conducting cover and the heating element.

### Claim 12 (depends on 8)

The electronic device according to claim 8, wherein: the heat absorbing material filler is a phase-change-energy-storage material filler; both a phase change temperature of the phase-change-energy-storage material fillers and a deformation temperature of the heat conducting cover are greater than a high-power housing temperature of the electronic device, and the phase change temperature is not less than the deformation temperature; the high-power housing temperature is a temperature of the housing of the electronic device when an operating power consumption of the electronic device is greater than a power consumption threshold.

### Claim 13

A heat dissipation method for an electronic device, comprising:
disposing a heat dissipating device in the electronic device, the heat dissipation device comprising:
a heat conducting cover disposed on a heating element of the electronic device, the heat conducting cover forming a closed cavity accommodating a heating element of the electronic device, the heat conducting cover comprising a heat conductive shape-memory material, the heat conducting cover configured to deform from a first shape to a second shape after a temperature of the electronic device increases to a first threshold, and configured to restore from the second shape to the first shape after the temperature of the electronic device decreases to a second threshold; and
a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover,
wherein, the heat absorbing material filler deforms structurally, in response to heat generated by the heating element, to absorb the heat generated from the heating element.

### Claim 14 (depends on 13)

The method according to claim 13, wherein:
after a temperature of the electronic device increases, but does not reach the first threshold, the heat conducting cover of the heat dissipation device maintains the first shape, and the heat generated by the electronic device is transferred to a housing of the electronic device for heat dissipation;
after the temperature of the electronic device increases to the first threshold, the heat conducting cover of the heat dissipation device deforms from the first shape to the second shape, and stores at least part of the heat generated by the electronic device.

### Claim 15 (depends on 14)

The method according to claim 14, wherein:
the heat dissipation device in the second shape stores a part of the heat generated by the electronic device, and transfers another part of the heat to the housing for the heat dissipation;
after the temperature of the electronic device decreases from the first threshold to the second threshold, the heat conducting cover restores from the second shape to the first shape, and the heat dissipation device releases and transfers the stored heat to the housing for the heat dissipation.

### Claim 16 (depends on 13)

The method according to claim 13, wherein:
in response to the heat conducting cover being in the first shape, the heat absorbing material filler does not contact the heating element of the electronic device, and
in response to the heat conducting cover being in the second shape, the heat absorbing material filler contacts the heating element.