# US 10,772,228 B2 · Sealed package including electronic device and power source

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- Number: US 10,772,228 B2
- Document ID: US10772228B2
- Status: Granted
- Kind: B2
- Application number: 15/299,941
- Filed: 2016-10-21
- Published: 2017-05-04
- Granted: 2020-09-08
- Earliest claimed: 2015-11-03
- Assignees: Medtronic, Inc.
- Applicants: Medtronic, Inc.
- Inventors: John K Day; Michael J Nidelkoff; Kris A Peterson; Andrew J Ries; David A Ruben; Craig L Wiklund
- Web page: https://patentgrep.com/patent/US10772228B2

## CPC

- H05K 5/069: {Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft}
- A61J 1/00: Containers specially adapted for medical or pharmaceutical purposes (capsules or the like for oral use A61J3/07; specially adapted for surgical or diagnostic appliances or instruments A61B50/30; containers for radioactive substances G21F5/00)
- A61N 1/3758: {Packaging of the components within the casing}
- A61N 1/378: Electrical supply
- H05K 5/0086: {portable, e.g. battery operated apparatus (casings for switching devices H01H9/02)}
- H05K 7/1417: {having securing means for mounting boards, plates or wiring boards (H05K7/1461 takes precedence)}
- H01M 50/55: on the same side of the cell
- H01M 2220/30: Batteries in portable systems, e.g. mobile phone, laptop
- Y02E 60/10: Energy storage using batteries
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- A61J: CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
- A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B)
- H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.

## Claims

### Claim 1

A hermetically-sealed package, comprising:
a housing comprising an inner surface, an outer surface, and a cavity;
a non-conductive substrate comprising a first major surface and a second major surface, wherein the non-conductive substrate is substantially transparent;
an electronic device disposed on the first major surface of the substrate and comprising a device contact;
a power source disposed at least partially within the cavity of the housing and comprising a resilient power source contact; and
an electrode disposed on the second major surface of the substrate, wherein the electrode is electrically connected to the electronic device by a via formed between the first major surface and the second major surface of the substrate;
wherein the substrate is hermetically sealed to the housing by a laser bond such that a non-bonded electrical connection is formed within the cavity of the housing between the device contact and the resilient power source contact.

### Claim 2 (depends on 1)

The package of claim 1, wherein the power source further comprises a retaining member that is in contact with the inner surface of the housing and stabilizes the power source relative to the inner surface of the housing.

### Claim 3 (depends on 2)

The package of claim 2, wherein the retaining member provides a friction-fit between the power source and the inner surface of the housing.

### Claim 4 (depends on 2)

The package of claim 2, wherein the retaining member comprises a spring plate disposed on the power source.

### Claim 5 (depends on 1)

The package of claim 1, wherein the housing forms at least a portion of an outer casing of the power source.

### Claim 6 (depends on 1)

The package of claim 1, wherein the housing comprises a flange surrounding the cavity of the housing, wherein the substrate is hermetically sealed to the flange.

### Claim 7 (depends on 1)

The package of claim 1, wherein the first major surface of the substrate is hermetically sealed to the housing such that the electronic device is disposed in the cavity between the substrate and the inner surface of the housing.

### Claim 8 (depends on 1)

The package of claim 1, further comprising an antenna disposed on the second major surface of the substrate and electrically connected to the electronic device by a via formed between the first major surface and the second major surface of the substrate.

### Claim 9 (depends on 1)

The package of claim 1, further comprising an antenna disposed within the substrate and electrically connected to the electronic device by a via formed between the antenna and the first major surface of the substrate.

### Claim 10 (depends on 1)

The package of claim 1, wherein the electronic device comprises a multiplexer.

### Claim 11 (depends on 1)

The package of claim 1, wherein the electronic device comprises a controller.

### Claim 12 (depends on 1)

The package of claim 1, wherein the electronic device comprises an implantable medical device.

### Claim 13 (depends on 1)

The package of claim 1, wherein the power source comprises a battery.

### Claim 14 (depends on 1)

The package of claim 1, wherein the power source contact comprises positive and negative terminals disposed at a first end of the power source.

### Claim 15 (depends on 1)

The package of claim 1, wherein the non-conductive substrate is substantially transmissive to light having a wavelength of between 200 nm to 10,000 nm.

### Claim 16 (depends on 1)

The package of claim 1, wherein the non-conductive substrate comprises at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, or gallium nitride, or any combinations thereof.

### Claim 17 (depends on 1)

The package of claim 1, wherein the housing comprises at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, MP35N, or gallium nitride.

### Claim 18 (depends on 1)

The package of claim 1, wherein the electrode comprises a first electrode, wherein the package further comprises a second electrode disposed on the second major surface of the non-conductive substrate.

### Claim 19 (depends on 18)

The package of claim 18, wherein the second electrode is electrically connected to the electronic device by a via formed between the first major surface and the second major surface of the non-conductive substrate.

### Claim 20 (depends on 18)

The package of claim 18, wherein the first and second electrodes are adapted to at least one of deliver or receive electrical signals to or from a patient.
