# US 10,772,216 B2 · Electronic component, electronic device, and method for mounting electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,216 B2 - Document ID: US10772216B2 - Status: Granted - Kind: B2 - Application number: 16/197,403 - Filed: 2018-11-21 - Published: 2019-03-21 - Granted: 2020-09-08 - Earliest claimed: 2017-02-23 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Shingo Ito - Web page: https://patentgrep.com/patent/US10772216B2 ## CPC - H05K 3/4617: {characterized by laminating only or mainly similar single-sided circuit boards} - H05K 1/0269: {for visual or optical inspection} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H05K 1/0266: {Marks, test patterns or identification means} - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 3/4626: {characterised by the insulating layers or materials (H05K3/4688 takes precedence)} - H05K 2201/09918: Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components - H05K 2203/166: Alignment or registration; Control of registration - H10W 46/301: {for alignment} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An electronic component includes a multilayer body including insulating base materials laminated on each other and including first and second main surfaces perpendicular or substantially perpendicular to a lamination direction, and an alignment mark is defined by a conductor on one of the insulating base materials. The multilayer body includes a first layer area at a side of the first main surface and a second layer area at a side of the second main surface with respect to the alignment mark. An insulating base material in the first layer area has higher translucency than an insulating base material in the second layer area. The alignment mark is a trapezoidal cross-sectional shape including a first base at the side of the first main surface and a second base at the side of second main surface, the first base being longer than the second base. ## Claims ### Claim 1 An electronic component comprising: a multilayer body including a plurality of insulating base materials laminated on each other and including a first main surface and a second main surface which are perpendicular or substantially perpendicular to a lamination direction; and an alignment mark defined by a conductor and provided on one insulating base material among the plurality of insulating base materials; wherein the multilayer body includes a first layer area located at a side of the first main surface with respect to the alignment mark and a second layer area located at a side of the second main surface with respect to the alignment mark, at least in a region in which the alignment mark is provided as viewed in the lamination direction; an insulating base material in the first layer area has higher translucency than an insulating base material in the second layer area; and a cross-sectional shape of the alignment mark in the lamination direction is a trapezoidal shape including a first base at the side of the first main surface and a second base at the side of the second main surface, the first base being longer than the second base, and the first base being substantially a portion of a surface of the one insulating base material on which the alignment mark is provided. ### Claim 2 (depends on 1) The electronic component according to claim 1, wherein the insulating base material in the first layer area among the plurality of insulating base materials includes an insulating base material made of a same material as the insulating base material in the second layer area. ### Claim 3 (depends on 1) The electronic component according to claim 1, wherein a conductor pattern which defines a circuit or a portion of a circuit is provided on at least one of the insulating base materials, and the alignment mark is made of a same material as the conductor pattern. ### Claim 4 (depends on 3) The electronic component according to claim 3, wherein the conductor pattern and the alignment mark are patterned by etching of a copper foil attached to the at least one of the insulating base materials. ### Claim 5 (depends on 1) The electronic component according to claim 1, wherein the insulating base material in the first layer area and the insulating base material in the second layer area are made of a same material, and the first layer area has a smaller thickness than the second layer area. ### Claim 6 (depends on 1) The electronic component according to claim 1, wherein the second layer area includes an adhesive layer joining the insulating base material in the second layer area and the insulating base material in the first layer area, or an adhesive layer joining the insulating base materials in the second layer area, and the adhesive layer has a lower light transmittance than the insulating base material in the first layer area. ### Claim 7 (depends on 1) An electronic device comprising: a circuit board; and the electronic component according to claim 1; wherein the electronic component is mounted on the circuit board; and the electronic component includes a mounting terminal to mount the electronic component onto the circuit board. ### Claim 8 (depends on 7) The electronic device according to claim 7, wherein the insulating base material in the first layer area among the plurality of insulating base materials includes an insulating base material made of a same material as the insulating base material in the second layer area. ### Claim 9 (depends on 7) The electronic device according to claim 7, wherein a conductor pattern which defines a circuit or a portion of a circuit is provided on at least one of the insulating base materials, and the alignment mark is made of a same material as the conductor pattern. ### Claim 10 (depends on 9) The electronic device according to claim 9, wherein the conductor pattern and the alignment mark are patterned by etching of a copper foil attached to the at least one of the insulating base materials. ### Claim 11 (depends on 7) The electronic device according to claim 7, wherein the insulating base material in the first layer area and the insulating base material in the second layer area are made of a same material, and the first layer area has a smaller thickness than the second layer area. ### Claim 12 (depends on 7) The electronic device according to claim 7, wherein the second layer area includes an adhesive layer joining the insulating base material in the second layer area and the insulating base material in the first layer area, or an adhesive layer joining the insulating base materials in the second layer area, and the adhesive layer has a lower light transmittance than the insulating base material in the first layer area. ### Claim 13 (depends on 1) A method for mounting the electronic component according to claim 1 onto a circuit board, the method comprising: detecting the alignment mark of the electronic component by a reflection method in which the alignment mark is seen from the side of the first main surface; and mounting the electronic component to a specified position on the circuit board in accordance with a detected position of the electronic component. ### Claim 14 (depends on 13) The method according to claim 13, wherein the insulating base material in the first layer area among the plurality of insulating base materials includes an insulating base material made of a same material as the insulating base material in the second layer area. ### Claim 15 (depends on 13) The method according to claim 13, wherein a conductor pattern which defines a circuit or a portion of a circuit is provided on at least one of the insulating base materials, and the alignment mark is made of a same material as the conductor pattern. ### Claim 16 (depends on 15) The method according to claim 15, wherein the conductor pattern and the alignment mark are patterned by etching of a copper foil attached to the at least one of the insulating base materials. ### Claim 17 (depends on 13) The method according to claim 13, wherein the insulating base material in the first layer area and the insulating base material in the second layer area are made of a same material, and the first layer area has a smaller thickness than the second layer area. ### Claim 18 (depends on 13) The method according to claim 13, wherein the second layer area includes an adhesive layer joining the insulating base material in the second layer area and the insulating base material in the first layer area, or an adhesive layer joining the insulating base materials in the second layer area, and the adhesive layer has a lower light transmittance than the insulating base material in the first layer area.