# US 10,772,215 B2 · Conductive polymers within drilled holes of printed circuit boards

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- Number: US 10,772,215 B2
- Document ID: US10772215B2
- Status: Granted
- Kind: B2
- Application number: 15/650,227
- Filed: 2017-07-14
- Published: 2019-01-17
- Granted: 2020-09-08
- Earliest claimed: 2017-07-14
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Joseph Kuczynski; Timothy Tofil; Jeffrey N. Judd; Matthew Doyle; Scott D. Strand
- Web page: https://patentgrep.com/patent/US10772215B2

## CPC

- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- H05K 1/0292: {having a modifiable lay-out, i.e. adapted for engineering changes or repair (H05K1/0293 takes precedence)}
- H05K 3/4069: {for via connections in organic insulating substrates}
- H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers}
- H10P 14/683: {carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC}
- H05K 1/0251: {related to vias or transitions between vias and transmission lines}
- H05K 1/0298: {Multilayer circuits}
- H05K 2201/0329: Intrinsically conductive polymer [ICP]; Semiconductive polymer
- Y10T 29/49165: by forming conductive walled aperture in base
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

## Claims

### Claim 1

A computer program product comprising a computer readable storage medium, wherein the computer readable storage medium is not a transitory signal per se, the computer readable storage medium having program instructions embodied therewith, the programs instructions configured, when executed by at least one processor, to cause the at least processor to perform a method comprising:
sending a command to apply a triggering condition to a conductive polymer positioned in a drilled hole in a printed circuit board to vertically expand the polymer within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

### Claim 2 (depends on 1)

The computer program product of claim 1, wherein the method further comprises:
sending a command to remove the triggering condition from the expanded polymer, whereby the polymer vertically contracts within the drilled hole such that the electrically conductive path between the contact pads is broken.

### Claim 3 (depends on 1)

The computer program product of claim 1, wherein electronic components communicate across the electrically conductive path created by the expanded polymer.

### Claim 4 (depends on 1)

The computer program product of claim 1, wherein the polymer comprises a composite with an elastomer matrix and a conductive filler, and the triggering condition is heat applied to the polymer.

### Claim 5 (depends on 1)

The computer program product of claim 1, wherein the polymer comprises an electroactive polymer, and the triggering condition is voltage applied to the polymer.

### Claim 6 (depends on 4)

The computer program product of claim 4, wherein the heat is applied via a heated filament positioned in or near the polymer.

### Claim 7 (depends on 5)

The computer program product of claim 5, wherein the voltage is applied via additional contact pads arranged vertically outside of the contacts pads within the drilled hole.

### Claim 8 (depends on 1)

The computer program product of claim 1, wherein the polymer comprises gas-filled microspheres, and the triggering condition is a pressure decrease applied to the polymer such that the microspheres expand.

### Claim 9

A printed circuit board comprising a conductive polymer positioned in a drilled hole in the printed circuit board, the conductive polymer configured, responsive to an applied triggering condition, to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

### Claim 10 (depends on 9)

The printed circuit board of claim 9, wherein the triggering condition is configured to be applied responsive to a command from a processor to establish an electrical connection between the contact pads.

### Claim 11 (depends on 9)

The printed circuit board of claim 9, wherein the application of the triggering condition allows electronic components to communicate across the electrically conductive path created by the expanded polymer.

### Claim 12 (depends on 9)

The printed circuit board of claim 9, wherein the polymer comprises a composite with an elastomer matrix and a conductive filler, and the triggering condition is heat applied to the polymer.

### Claim 13 (depends on 9)

The printed circuit board of claim 9, wherein the polymer comprises an electroactive polymer, and the triggering condition is voltage applied to the polymer.