# US 10,772,214 B2 · Circuit board manufacturing method

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- Number: US 10,772,214 B2
- Document ID: US10772214B2
- Status: Granted
- Kind: B2
- Application number: 16/679,761
- Filed: 2019-11-11
- Published: 2020-05-14
- Granted: 2020-09-08
- Earliest claimed: 2018-11-14
- Assignees: Toyota Jidosha Kabushiki Kaisha; Denso Corporation
- Applicants: Toyota Jidosha Kabushiki Kaisha; Denso Corporation
- Inventors: Masafumi Momose; Tetsuya Dewa
- Web page: https://patentgrep.com/patent/US10772214B2

## CPC

- B23K 1/0016: {Soldering of electronic components}
- H05K 3/328: by welding
- B23K 1/0056: {soldering by means of beams, e.g. lasers, electron beams [EB]}
- B23K 1/20: Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K 3/08: Auxiliary devices therefor
- B23K 26/22: Spot welding
- H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
- H05K 3/3447: Lead-in-hole components
- B23K 2101/42: Printed circuits
- H05K 1/0266: {Marks, test patterns or identification means}
- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)}
- H05K 2201/0939: Curved pads, e.g. semi-circular or elliptical pads or lands
- H05K 2201/09409: Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
- H05K 2201/09418: Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
- H05K 2201/09609: Via grid, i.e. two-dimensional array of vias or holes in a single plane
- H05K 2201/10166: Transistor
- H05K 2201/10303: Pin-in-hole mounted pins
- H05K 2201/10704: Pin grid array [PGA]
- H05K 2201/10901: Lead partly inserted in hole or via
- H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
- H05K 2203/107: Using laser light
- Y10T 29/49147: Assembling terminal to base
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained.

## Claims

### Claim 1

A manufacturing method for a circuit board, comprising:
welding a terminal pin to a land, the terminal pin being inserted in a through-hole of the land, wherein:
the land is covered with a white layer; and
an irradiation angle of a laser beam for welding with respect to the circuit board is adjusted so that reflected light which is a light of the laser beam emitted to the terminal pin reflected by the terminal pin strikes the white layer on the land.

### Claim 2 (depends on 1)

The manufacturing method according to claim 1, wherein the irradiation angle is adjusted so that the reflected light does not strike the circuit board except the white layer.

### Claim 3 (depends on 1)

The manufacturing method according to claim 1, wherein the irradiation angle is adjusted so that the laser beam is emitted to a side surface of the terminal pin and also emitted to an inner surface of the through-hole.

### Claim 4 (depends on 1)

The manufacturing method according to claim 1, wherein an area of the land on a laser beam incident side with respect to the through-hole is larger than an area of the land on an opposite side to the laser beam incident side with respect to the through-hole.