# US 10,772,210 B2 · Solution property sensor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,210 B2 - Document ID: US10772210B2 - Status: Granted - Kind: B2 - Application number: 16/153,771 - Filed: 2018-10-07 - Published: 2020-04-09 - Granted: 2020-09-08 - Earliest claimed: 2018-10-07 - Assignees: National Sun Yat-Sen University - Applicants: National Sun Yat-sen University - Inventors: Che-hsin Lin; Wei-hsing Yen; Wei-sin Kao - Web page: https://patentgrep.com/patent/US10772210B2 ## CPC - H05K 1/181: associated with surface mounted components - H05K 1/189: characterised by the use of flexible or folded printed circuits - G01K 7/16: using resistive elements - G01K 13/02: for measuring temperature of moving fluids or granular materials capable of flow - G01K 13/026: {of moving liquids} - G01N 27/10: Investigation or analysis specially adapted for controlling or monitoring operations or for signalling - G01N 27/4167: {pH (electrodes therefor G01N27/302, G01N27/36)} - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] - H05K 3/305: {Affixing by adhesive} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 2201/05: Flexible printed circuits [FPCs] - H05K 2201/095: Conductive through-holes or vias - H05K 2201/09972: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently - H05K 2201/10151: Sensor - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00) - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A solution property sensor is provided and has: a substrate, a temperature sensing element, an electrical conductivity sensing element, a pH value sensing element, and a reference electrode. The solution property sensor utilizes different sensing elements to sense various solution properties, and all of these sensing elements can be electrically connected and fixed to conductive patterns on the same substrate, thereby facilitating mass production in the industry or reducing production difficulty. ## Claims ### Claim 1 A solution property sensor, comprising: a substrate having a front surface and a back surface, wherein the substrate defines a temperature sensing region, an electrical conductivity sensing region, a pH value sensing region, and an electrical signal output region, wherein the substrate includes: a plurality of conductive patterns disposed on the front surface or the back surface of the substrate, wherein the conductive patterns are electrically isolated with each other and include two temperature conductive wires, at least two electrical conductivity conductive wires, a pH value conductive wire, and a reference electrode conductive wire, wherein the conductive patterns further comprises a pH value conductive pattern electrically connected to the pH value conductive wire and disposed on the front surface or the back surface of the substrate; and a plurality of electrical connection pins disposed on the electrical signal output region and electrically connected to the conductive patterns, respectively; a temperature sensing element disposed on the temperature sensing region and electrically connected to the two temperature conductive wires; an electrical conductivity sensing element disposed on the electrical conductivity sensing region and electrically connected to the at least two electrical conductivity conductive wires; a pH value sensing element disposed on the pH value sensing region and electrically connected to the pH value conductive wire, wherein a material of the pH value sensing element includes indium tin oxide, and the pH value sensing element has a sensing surface formed of indium tin oxide and configured to sense a pH value of a solution, wherein the pH value sensing element is a rectangular plate member, wherein the pH value sensing element is electrically connected to the pH value conductive pattern, wherein a width of the pH value conductive pattern is substantially a width of the rectangular plate member, and a length of the pH value conductive pattern is 10% to 50% of a length of the rectangular plate; and a reference electrode disposed on the substrate and electrically connected to the reference electrode conductive wire. ### Claim 2 (depends on 1) The solution property sensor according to claim 1, further comprising a waterproof layer covering at least one of the temperature sensing region and the electrical signal output region. ### Claim 3 (depends on 1) The solution property sensor according to claim 1, wherein the electrical conductivity sensing element is an exposed portion of each of the at least two electrical conductivity conductive wires, wherein each of the exposed portions is exposed to a surface of the electrical conductivity sensing region. ### Claim 4 (depends on 3) The solution property sensor according to claim 3, wherein the exposed portion is circular or square. ### Claim 5 (depends on 4) The solution property sensor according to claim 4, wherein: when the exposed portion is circular, a diameter of the exposed portion ranges from 0.2 mm to 1.0 mm; or when the exposed portion is square, a length and a width of the exposed portion range from 0.2 mm to 1.0 mm, respectively. ### Claim 6 (depends on 1) The solution property sensor according to claim 1, wherein the pH value conductive pattern is disposed on the back surface of the substrate, and the substrate comprises a hole passing through the pH value sensing region, wherein the pH value sensing element exposes the sensing surface through the hole. ### Claim 7 (depends on 6) The solution property sensor according to claim 6, further comprising a conductive adhesive material adhered to and electrically connected between the pH value conductive pattern and a portion of the sensing surface of the pH value sensing element. ### Claim 8 (depends on 1) The solution property sensor according to claim 1, further comprising a conductive adhesive material adhered to and electrically connected between the pH value conductive pattern and a portion of the sensing surface of the pH value sensing element. ### Claim 9 (depends on 1) The solution property sensor according to claim 1, wherein the substrate is a printed circuit board or a flexible circuit board. ### Claim 10 (depends on 1) The solution property sensor according to claim 1, wherein the temperature sensing region and the electrical signal output region are respectively defined on two opposite sides of the substrate.