# US 10,772,207 B2 · Flexible semiconductor package and method for fabricating the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,207 B2 - Document ID: US10772207B2 - Status: Granted - Kind: B2 - Application number: 15/951,731 - Filed: 2018-04-12 - Published: 2019-03-07 - Granted: 2020-09-08 - Earliest claimed: 2017-09-01 - Assignees: MagnaChip Semiconductor, Ltd. - Applicants: Magnachip Semiconductor, Ltd. - Inventors: Kyeong Su Kim; Shin Park; Jae Jin Lee - Web page: https://patentgrep.com/patent/US10772207B2 ## CPC - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - G02F 1/13452: {Conductors connecting driver circuitry and terminals of panels} - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H10W 70/688: {Flexible insulating substrates} - H05K 2201/0154: Polyimide - H05K 2201/09018: Rigid curved substrate - H05K 2201/10128: Display - H05K 2201/10681: Tape Carrier Package [TCP]; Flexible sheet connector - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package attached to a curved display panel includes a semiconductor chip, having a top surface and a bottom surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel, a flexible cover layer attached to the top surface of the semiconductor chip, and an underfill material formed between the semiconductor chip and the curved flexible film, and wherein the top surface of the semiconductor chip is planar. ## Claims ### Claim 1 A semiconductor package attached to a curved display panel, comprising: a semiconductor chip, having a top surface and a side surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel; a flexible cover layer attached to the top surface and the side surface of the semiconductor chip; and an underfill material formed between the semiconductor chip and the curved flexible film, and overlapping a solder resist, wherein the flexible cover layer is in direct contact with the underfill material, the solder resist, and the top and side surfaces of the semiconductor chip, and wherein the top surface of the semiconductor chip on the curved flexible film remains flat. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein the flexible cover layer is formed to cover the top surface and the side surface of the semiconductor chip. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the semiconductor chip has a thickness of 50 to 250 μm. ### Claim 4 (depends on 1) The semiconductor package of claim 1, wherein the flexible cover layer has a thickness of 0.1 to 0.8 mm. ### Claim 5 (depends on 1) The semiconductor package of claim 1, wherein the flexible cover layer comprises a mixture of a non-conductive silicon-based material and a conductive filler material. ### Claim 6 (depends on 5) The semiconductor package of claim 5, wherein the flexible cover layer further comprises resin material. ### Claim 7 (depends on 5) The semiconductor package of claim 5, wherein a percentage of the non-conductive silicon-based material in the flexible cover layer is greater than a percentage of the conductive filler material in the flexible cover layer. ### Claim 8 (depends on 5) The semiconductor package of claim 5, wherein the filler material is any one or any combination of any two or more of alumina, aluminum nitride, boron nitride, carbon nitride, graphene, and diamond. ### Claim 9 (depends on 1) The semiconductor package of claim 1, further comprising metal wires formed on the flexible film comprising terminals configured to accept the semiconductor chip. ### Claim 10 (depends on 9) The semiconductor package of claim 9, further comprising bumps formed on the metal wires, wherein the bumps connect the metal wires to the semiconductor chip. ### Claim 11 (depends on 9) The semiconductor package of claim 9, wherein the solder resist is formed on the metal wires to cover a complete area, except for the terminals, of the metal wires. ### Claim 12 (depends on 1) The semiconductor package of claim 1, wherein the semiconductor chip comprises a source driver IC or a gate driver IC. ### Claim 13 (depends on 1) The semiconductor package of claim 1, wherein the underfill material has a higher viscosity than the flexible cover layer. ### Claim 14 (depends on 1) The semiconductor package of claim 1, wherein the underfill material comprises non-conductive silicon-based materials and conductive filler materials. ### Claim 15 (depends on 1) The semiconductor package of claim 1, wherein the flexible cover layer has a shape of a tape. ### Claim 16 (depends on 1) The semiconductor package of claim 1, wherein the underfill material and the flexible cover layer comprise a same material. ### Claim 17 A semiconductor package attached to a curved display panel having front, rear and side surfaces, comprising: a semiconductor chip having a top surface, a side surface and a bottom surface disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel; an underfill material formed between the semiconductor chip and the curved flexible film and overlapping a solder resist; and a flexible cover layer formed on the top surface and the side surface of the semiconductor chip and being in direct contact with the underfill material, the solder resist, the top surface and the side surface of the semiconductor chip, wherein the semiconductor chip on the curved flexible film is attached to the side surface of the curved display panel, and wherein the bottom surface of the semiconductor chip on the curved flexible film is curved. ### Claim 18 (depends on 17) The semiconductor package of claim 17, wherein the underfill material and the flexible cover layer comprise a same material. ### Claim 19 (depends on 17) The semiconductor package of claim 17, wherein the underfill material and the flexible cover layer comprise non-conductive silicon-based materials and conductive filler materials, and wherein a percentage of the non-conductive silicon-based materials is greater than a percentage of the conductive filler materials. ### Claim 20 (depends on 1) The semiconductor package of claim 1, wherein the flexible cover layer is in direct contact with the semiconductor chip. ### Claim 21 (depends on 17) The semiconductor package of claim 17, wherein a central portion of the flexible cover layer disposed on the semiconductor chip is thicker than an edge portion of the flexible cover layer. ### Claim 22 (depends on 17) The semiconductor package of claim 17, wherein the flexible cover layer has a thickness in a range of 0.1 to 0.8 mm. ### Claim 23 A semiconductor package attached to a curved display panel, comprising: a semiconductor chip attached to a curved flexible film to be disposed on the curved display panel; a flexible tape attached to an upper surface of the semiconductor chip; and an underfill material overlapping a solder resist and formed between a lower surface of the semiconductor chip and the curved flexible film, wherein the flexible tape comprises either one or both of heat conductive filler and a curable material. ### Claim 24 (depends on 23) The semiconductor package of claim 23, wherein the flexible tape is made of a non-conductive silicon-based material. ### Claim 25 (depends on 23) The semiconductor package of claim 23, wherein the flexible tape has a thickness in a range of 10 to 50 μm. ### Claim 26 (depends on 23) The semiconductor package of claim 23, further comprising a flexible cover layer having a thickness larger than that of the flexible tape. ### Claim 27 (depends on 23) The semiconductor package of claim 23, wherein both edges of the flexible tape attached to the upper surface of the semiconductor chip coincide with both edges of the semiconductor chip.