# US 10,772,198 B2 · Organic insulator, metal-clad laminate and wiring board > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,198 B2 - Document ID: US10772198B2 - Status: Granted - Kind: B2 - Application number: 16/624,698 - Filed: 2018-06-26 - Published: 2020-04-23 - Granted: 2020-09-08 - Earliest claimed: 2017-06-27 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Tadashi Nagasawa; Satoshi Yoshiura; Chie Chikara - Web page: https://patentgrep.com/patent/US10772198B2 ## CPC - H01B 3/441: {from alkenes} - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - B32B 27/18: characterised by the use of special additives - B32B 27/30: comprising vinyl {(co)polymers; comprising acrylic (co)polymers} - B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} - C08J 5/249: {characterised by the additives used in the prepolymer mixture} - C08K 3/36: Silica - C08K 5/03: aromatic {, e.g. C6H5-CH2-Cl} - C08K 5/14: Peroxides - C08K 5/34926: {also containing heterocyclic groups other than triazine groups} - C08L 45/00: Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers (of cyclic anhydrides or imides C08L35/00; of cyclic esters of polyfunctional acids C08L31/00) - H01B 3/30: plastics; resins; waxes - H01B 3/44: vinyl resins; acrylic resins (silicones H01B3/46) - H05K 1/036: {Multilayers with layers of different types} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 3/4676: {Single layer compositions} - H05K 3/4688: {Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K3/4602)} - C08J 2323/08: Copolymers of ethene (C08J2323/16 takes precedence) - H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)} - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) ## Abstract An organic insulator is composed an organic resin phase as a main component. The organic resin phase includes a weather-resistant stabilizer. The organic resin phase includes an inner region and a surface region formed in at least one surface of the inner region. The surface region has a higher content ratio of the weather-resistance stabilizer than the inner region. A metal-clad laminate includes the organic insulator and a metallic foil laminated on at least one surface of the organic insulator. A wiring board includes a plurality of insulating layers composed of the organic insulator, and a metallic foil disposed between the insulating layers. ## Claims ### Claim 1 An organic insulator, comprising an organic resin phase as a main component, the organic resin phase comprising a weather-resistant stabilizer, the organic resin phase comprising an inner region and a surface region formed in at least one surface of the inner region, the surface region having a higher content ratio of the weather-resistance stabilizer than the inner region, wherein the organic resin phase comprises a thermosetting resin, and wherein the thermosetting resin is a cured material of a resin composition comprising a cyclic olefin copolymer having a crosslinkable functional group in a molecule, a monomer having at least two ethylenic unsaturated groups in a molecule, and a peroxide having a benzene ring in a molecule. ### Claim 2 (depends on 1) The organic insulator according to claim 1, wherein the organic insulator has a plate shape and, the surface region is present in a main surface having a largest area among surfaces of the organic insulator. ### Claim 3 (depends on 2) The organic insulator according to claim 2, wherein the surface region is present in two opposing main surfaces in the inner region. ### Claim 4 (depends on 1) The organic insulator according to claim 1, wherein the organic resin phase further comprises inorganic particles, and a content ratio of the inorganic particles in the surface region is lower than in the inner region. ### Claim 5 (depends on 1) The organic insulator according to claim 1, wherein the organic resin phase further comprises a flame retardant agent and has a relationship of SO/SI>FO/FI where SI is a content ratio of the weather-resistant stabilizer included in the inner region, SO is a content ratio of the weather-resistant stabilizer included in the surface region, FI is a content ratio of the flame retardant agent included in the inner region, and FO is a content ratio of the flame retardant agent included in the surface region. ### Claim 6 (depends on 1) The organic insulator according to claim 1, wherein the surface region has a layer shape. ### Claim 7 (depends on 1) The organic insulator according to claim 1, wherein the organic resin phase comprises a laminate structure comprising a plurality of unit layers laminated one upon another. ### Claim 8 (depends on 7) The organic insulator according to claim 7, wherein an interface where the unit layers are overlapped with each other has a lower content ratio of at least one of the weather-resistant stabilizer and the inorganic particles than portions of the unit layers except for the interface. ### Claim 9 (depends on 1) The organic insulator according to claim 1, wherein the organic resin phase comprises a thermoplastic resin. ### Claim 10 (depends on 9) The organic insulator according to claim 9, wherein a main component of the thermoplastic resin is a cyclic olefin copolymer. ### Claim 11 (depends on 1) The organic insulator according to claim 1, wherein the thermosetting resin comprises mainly of a cyclic olefin copolymer and comprises a peroxide having a benzene ring. ### Claim 12 (depends on 1) The organic insulator according to claim 1, wherein the monomer having the ethylenic unsaturated groups comprises at least one kind selected from the group consisting of tricylodecane dimethanol diacrylate, tricylodecane dimethanol dimethacrylate and triallyl isocyanurate. ### Claim 13 (depends on 1) The organic insulator according to claim 1, wherein the monomer having the ethylenic unsaturated groups is included in an amount of 1 mass parts or more but 8 mass parts or less relative to 100 mass parts of the cyclic olefin copolymer. ### Claim 14 (depends on 1) The organic insulator according to claim 1, further comprising 1,2-bis(2,3,4,5, 6-pentabromophenyl)ethane as a flame retardant agent. ### Claim 15 (depends on 1) A metal-clad laminate, comprising: an organic insulator according to claim 1, and a metallic foil laminated on at least one surface of the organic insulator. ### Claim 16 (depends on 1) A wiring board, comprising: a plurality of insulating layers composed of an organic insulator according to claim 1; and a metallic foil disposed between the insulating layers.