# US 10,772,195 B2 · Two-dimensional data matrix structure and the fabrication method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,195 B2 - Document ID: US10772195B2 - Status: Granted - Kind: B2 - Application number: 15/980,739 - Filed: 2018-05-16 - Published: 2019-10-24 - Granted: 2020-09-08 - Earliest claimed: 2018-04-20 - Assignees: Unimicron Technology Corp. - Applicants: Unimicron Technology Corp. - Inventors: Jun-Jie Chang; Shian-Tang Chang; Dung-Ying Sung - Web page: https://patentgrep.com/patent/US10772195B2 ## CPC - H05K 1/0266: {Marks, test patterns or identification means} - B23K 26/382: by boring - B23K 26/386: of blind holes - H05K 3/0026: {by laser ablation} - H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)} - B23K 2103/166: {Multilayered materials} - B32B 3/266: {characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12} - H05K 2201/09827: Tapered, e.g. tapered hole, via or groove - H05K 2201/09927: Machine readable code, e.g. bar code - H05K 2203/107: Using laser light - Y10T 428/24322: Composite web or sheet - Y10T 428/24331: including nonapertured component - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above. ## Claims ### Claim 1 A two-dimensional data matrix structure, comprising: a first substrate; a first metal layer disposed on the first substrate, wherein the first metal layer has a plurality of sections and a plurality of empty regions that are formed according to a two-dimensional data matrix pattern, and each of the empty regions is between two of the sections; a second substrate disposed on the first metal layer; and a second metal layer disposed on the second substrate, wherein the first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, positions of the through holes correspond to positions of the empty regions, the second substrate and the second metal layer commonly have a plurality of blind holes, positions of the blind holes correspond to positions of the sections, the sections of the first metal layer are exposed through the blind holes, and a configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above. ### Claim 2 (depends on 1) The two-dimensional data matrix structure of claim 1, wherein the first metal layer and the second metal layer are electrically insulated from each other. ### Claim 3 (depends on 1) The two-dimensional data matrix structure of claim 1, wherein diameters of the blind holes and diameters of the through holes are in a range from 250 nm to 270 nm. ### Claim 4 (depends on 3) The two-dimensional data matrix structure of claim 3, wherein the diameters of the blind holes and the diameters of the through holes are substantially the same. ### Claim 5 (depends on 1) The two-dimensional data matrix structure of claim 1, wherein widths of the sections of the first metal layer are greater than diameters of the blind holes. ### Claim 6 (depends on 1) The two-dimensional data matrix structure of claim 1, further comprising: a third metal layer disposed on a surface of the first substrate facing away from the first metal layer. ### Claim 7 (depends on 1) The two-dimensional data matrix structure of claim 1, wherein the first substrate and the second substrate respectively has a first sidewall and a second sidewall facing one of the through holes, one of the sections of the first metal layer has a third sidewall facing one of the through holes, and the third sidewall is recessed in the first sidewall and the second sidewall. ### Claim 8 A fabrication method of a two-dimensional data matrix structure, comprising: forming a first metal layer on the first substrate, wherein the first metal layer has a plurality of sections and a plurality of empty regions that are formed according to a two-dimensional data matrix pattern; forming a second substrate on the first metal layer; forming a second metal layer on the second substrate; and forming a plurality of through holes in the first substrate, the second substrate and the second metal layer and forming a plurality of blind holes in the second substrate and the second metal layer by using a laser, wherein positions of the through holes correspond to positions of the empty regions, positions of the blind holes correspond to positions of the sections, and a configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above. ### Claim 9 (depends on 8) The fabrication method of a two-dimensional data matrix structure of claim 8, further comprising: performing a surface treatment on the second metal layer before forming the through holes and the blind holes by using a laser. ### Claim 10 (depends on 8) The fabrication method of a two-dimensional data matrix structure of claim 8, further comprising: positioning a plurality of positions of a plurality of two-dimensional matrix holes on the second metal layer according to the two-dimensional data matrix pattern before forming the through holes and the blind holes by using a laser, wherein the positions of the two-dimensional matrix holes are the positions of the through holes and the blind holes.