# US 10,772,192 B2 · Board-to-board contactless connectors and methods for the assembly thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,192 B2 - Document ID: US10772192B2 - Status: Granted - Kind: B2 - Application number: 15/145,589 - Filed: 2016-05-03 - Published: 2017-11-09 - Granted: 2020-09-08 - Earliest claimed: 2016-05-03 - Assignees: Keyssa Systems, Inc. - Applicants: Keyssa Systems, Inc. - Inventors: Roger D. Isaac; Mostafa Naguib Abdulla - Web page: https://patentgrep.com/patent/US10772192B2 ## CPC - H05K 1/0237: {High frequency adaptations (H05K1/0216 takes precedence)} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H04B 1/03: Constructional details, e.g. casings, housings - H04B 1/08: Constructional details, e.g. cabinet - H05K 1/0239: {Signal transmission by AC coupling} - H05K 1/0296: {Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18)} - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 1/181: associated with surface mounted components - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} - H10W 76/01: Manufacture or treatment - H10W 76/12: characterised by their shape - H10W 90/00: Package configurations - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/10128: Display - H05K 2203/16: Inspection; Monitoring; Aligning - H05K 2203/162: Testing a finished product, e.g. heat cycle testing of solder joints - H10W 44/248: {for antennas} - H10W 72/07254: {changes in dispositions} - H10W 72/242: {relative to the surface, e.g. recessed, protruding} - H10W 72/50: Bond wires - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements} - H10W 72/879: {Bump connectors and bond wires} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H04B: TRANSMISSION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors. ## Claims ### Claim 1 A device comprising: a first circuit board comprising a first contactless communications unit (CCU) mounted to a first surface of the first circuit board; a second circuit board comprising a second CCU mounted to a second surface of the second circuit board, wherein the second circuit board is positioned below the first circuit board such that the first and second surfaces face each other and that a contactless board-to-board connection is established via the first and second CCUs, wherein each of the first and second CCUs comprises: a printed circuit board; a silicon die having a first side and a second side, wherein the first side is mounted to the printed circuit board; a dielectric layer disposed on the second side of the silicon die; a transducer disposed on the dielectric layer directly above the second side of the silicon die; a ground plane adjustment layer disposed on or within the dielectric layer, wherein the ground plane adjustment layer defines an effective ground plane for the transducer, and wherein the silicon die is an actual ground plane for the transducer and wherein the effective ground plane is different than the actual ground plane; and a collimating structure operative as a lens; and a conduit structure mounted to the first and second circuit boards, wherein the conduit structure comprises a EHF channel for directing contactless signals being communicated between the first and second CCUs. ### Claim 2 (depends on 1) The device of claim 1, wherein the contactless board-to-board connection enables contactless transmission of data between the first and second CCUs. ### Claim 3 (depends on 1) The device of claim 1, further comprising a plurality of post members that securely couple the first and second circuit boards in a fixed position with respect to each other. ### Claim 4 (depends on 3) The device of claim 3, wherein at least one of the post members comprises a conductor for conveying power between the first and second circuit boards. ### Claim 5 (depends on 1) The device of claim 1, further comprising at least one conductor coupled between the first and second circuit boards. ### Claim 6 (depends on 5) The device of claim 5, wherein the at least one conductor is a leaf spring or a wire. ### Claim 7 (depends on 1) The device of claim 1, wherein the collimating structure is operative to correct for a phase shift associated with the transducer. ### Claim 8 (depends on 1) The device of claim 1, wherein the second circuit board comprises a third CCU, the device further comprising: another circuit board comprising a fourth CCU, wherein the third and fourth CCUs form a contactless board-to-component connector for enabling contactless data transfer between the third and fourth CCUs. ### Claim 9 (depends on 1) The device of claim 1, wherein a gap separation between the first and second CCUs is controlled and wherein alignment axes associated with the first and second CCUs are substantially co-aligned. ### Claim 10 (depends on 1) The device of claim 1, wherein each of the first and second CCUs further comprises a mold that encapsulates the silicon die, the transducer, and the collimating structure. ### Claim 11 (depends on 1) The device of claim 1, wherein each of the first and second CCUs further comprises a mold that encapsulates the silicon die and transducer, wherein the collimating structure resides external to the mold. ### Claim 12 (depends on 1) The device of claim 1, wherein a physical distance between the actual ground plane and the transducer is less than one fourth of a radiating wavelength of contactless signals being transmitted or received by the first and second CCUs. ### Claim 13 (depends on 12) The device of claim 12, wherein an effective distance between the actual ground plane and the transducer is approximately one fourth of a radiating wavelength of contactless signals being transmitted or received by the first and second CCUs. ### Claim 14 A device comprising: a first circuit board comprising a first contactless communications unit (CCU) mounted to a first surface of the first circuit board; a second circuit board comprising a second CCU mounted to a second surface of the second circuit board, wherein the second circuit board is positioned below the first circuit board such that the first and second surfaces face each other and that a contactless board-to-board connection is established via the first and second CCUs, wherein each of the first and second CCUs comprises: a printed circuit board; a silicon die having a first side and a second side, wherein the first side is mounted to the printed circuit board; a dielectric layer disposed on the second side of the silicon die; a transducer disposed on the dielectric layer directly above the second side of the silicon die; and a ground plane adjustment layer disposed on or within the dielectric layer, wherein the ground plane adjustment layer defines an effective ground plane for the transducer, and wherein the silicon die is an actual ground plane for the transducer and wherein the effective ground plane is different than the actual ground plane; and a conduit structure mounted to the first and second circuit boards, wherein the conduit structure comprises a EHF channel for directing contactless signals being communicated between the first and second CCUs. ### Claim 15 (depends on 14) The device of claim 14, wherein a physical distance between the actual ground plane and the transducer is less than one fourth of a radiating wavelength of contactless signals being transmitted or received by the first and second CCUs. ### Claim 16 (depends on 15) The device of claim 15, wherein an effective distance between the actual ground plane and the transducer is approximately one fourth of a radiating wavelength of contactless signals being transmitted or received by the first and second CCUs.