# US 10,772,187 B2 · Electronic equipment and electronic device

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- Number: US 10,772,187 B2
- Document ID: US10772187B2
- Status: Granted
- Kind: B2
- Application number: 16/260,636
- Filed: 2019-01-29
- Published: 2019-08-29
- Granted: 2020-09-08
- Earliest claimed: 2018-02-23
- Assignees: NEC Corporation
- Applicants: NEC Corporation
- Inventors: Tomoyuki Mitsui
- Web page: https://patentgrep.com/patent/US10772187B2

## CPC

- H05K 1/0201: {Thermal arrangements, e.g. for cooling, heating or preventing overheating}
- H05B 3/26: heating conductor mounted on insulating base {(for transparent areas H05B3/84, H05B3/86)}
- H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)}
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 7/203: {by immersion}
- H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing}
- H05K 7/208: {Liquid cooling with phase change}
- H05K 7/1488: {Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures}
- H05K 2201/064: Fluid cooling, e.g. by integral pipes
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05B: ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL

## Abstract

Electronic equipment 100 includes a circuit board 10, a first housing 20, and a deformation suppressing portion 30. A heating element H is mounted on the circuit board 10. The first housing 20 is mounted on a first main surface 11 of the circuit board 10 in such a way that the heating element H and a coolant COO are sealed with respect to the first main surface 11. The deformation suppressing portion 30 suppresses deformation of the circuit board 10. According to this configuration, it is possible to suppress a failure such as leakage of a coolant and cutting of a wiring formed on a circuit board, even when a heating element and a coolant are sealed in a space surrounded by the circuit board and a housing.

## Claims

### Claim 1

Electronic equipment comprising:
a circuit board on which a heating element is mounted;
a first housing mounted on a first main surface of the circuit board in such a way that the heating element and a coolant are sealed with respect to the first main surface;
a deformation suppressing portion which suppresses deformation of the circuit board; and
a second housing mounted on a second main surface of the circuit board, the second main surface being on a side opposite to the first main surface in such a way that at least an area associated with a mounting area of the heating element is included on the second main surface, and the coolant is sealed with respect to the first housing via the circuit board, wherein
the deformation suppressing portion is a connection portion which connects a first space formed between the first main surface and the first housing, and a second space formed between the second main surface and the second housing in such a way that the coolant is allowed to flow between the first space and the second space.

### Claim 2 (depends on 1)

The electronic equipment according to claim 1, wherein
the coolant is capable of turning to a liquid-phase coolant and a gas-phase coolant by phase change.

### Claim 3 (depends on 1)

The electronic equipment according to claim 1, wherein
the first housing is configured to include a lid portion which faces the first main surface of the circuit board, and a frame portion which surrounds an outer peripheral portion of the lid portion.

### Claim 4 (depends on 3)

The electronic equipment according to claim 3, further comprising
an elastic member provided between the lid portion and the frame portion, wherein
the heating element and the coolant are sealed between the first main surface of the circuit board and the first housing by compressing the elastic member between the lid portion and the frame portion.

### Claim 5 (depends on 1)

The electronic equipment according to claim 1, further comprising
a heat radiating portion mounted to the first housing.

### Claim 6 (depends on 1)

The electronic equipment according to claim 1, further comprising
a connector portion provided on the circuit board, and connected to an electronic component, wherein
the first housing is mounted on the first main surface in such a way as not to cover the connector portion.

### Claim 7 (depends on 6)

An electronic device comprising:
the electronic equipment according to claim 6; and
an accommodation rack including an accommodation-rack-side connector portion connected to the connector portion,
the electronic equipment being mounted to the accommodation rack.