# US 10,772,186 B2 · Printed circuit board component cover > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,772,186 B2 - Document ID: US10772186B2 - Status: Granted - Kind: B2 - Application number: 15/543,206 - Filed: 2015-01-29 - Published: 2018-09-27 - Granted: 2020-09-08 - Earliest claimed: 2015-01-29 - Assignees: Hewlett-Packard Development Company, L.P. - Applicants: Hewlett-Packard Development Company, L.P. - Inventors: Adolfo Gomez; Tom J. Searby; Andrew L. Wiltzius - Web page: https://patentgrep.com/patent/US10772186B2 ## CPC - H05K 1/02: Details - B29C 51/002: {characterised by the choice of material} - B29C 51/266: {Auxiliary operations after the thermoforming operation (B29C51/42, B29C51/44, B29C51/46 take precedence)} - B29C 65/48: using adhesives {, i.e. using supplementary joining material; solvent bonding} - B29C 65/562: {using extra joining elements, i.e. which are not integral with the parts to be joined (using plastic snap elements B29C65/58; using plastic rivets B29C65/601)} - B29C 65/565: {involving interference fits, e.g. force-fits or press-fits (B29C65/66 takes precedence)} - H05K 5/03: Covers - B29K 2069/00: Use of PC, i.e. polycarbonates {or derivatives thereof}, as moulding material - B29L 2031/3425: {Printed circuits} - H05K 2201/10371: Shields or metal cases - H05K 2201/10409: Screws - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract A system for protecting components on a printed circuit board (PCB) includes a polycarbonate sheet. The polycarbonate sheet is formed to match a gross contour of a number of components coupled to the PCB. The system further includes a number of a fasteners to couple the polycarbonate sheet to the PCB. ## Claims ### Claim 1 A printed circuit board (PCB) component cover to protectively cover components on a printed circuit board (PCB), the cover comprising: an amount of non-conductive material, the non-conductive material formed to define a number of gross contours accommodating a number of components on the PCB, the non-conductive material comprising a number of apertures through each of which a respective component on the PCB extends when the cover is in place on the PCB, the non-conductive material additionally comprising a number of perforations, wherein the number and size of the perforations provide for cooling of components coupled to the PCB and covered by the PCB component cover, at least one of the apertures being completely surrounded by perforations of the number of perforations. ### Claim 2 (depends on 1) The PCB component cover of claim 1, wherein the non-conductive material is between 0.2 mm and 0.3 mm thick. ### Claim 3 (depends on 1) The PCB component cover of claim 1, wherein the non-conductive material is a polycarbonate sheet. ### Claim 4 (depends on 3) The PCB component cover of claim 3, wherein the polycarbonate sheet is a clear polycarbonate sheet. ### Claim 5 (depends on 1) The PCB component cover of claim 1, wherein the PCB is a motherboard of a computing device. ### Claim 6 (depends on 1) The PCB component cover of claim 1, wherein the PCB component cover is coupled to the PCB via a number of existing stand-off screws used to secure the PCB to a housing. ### Claim 7 (depends on 1) The PCB component cover of claim 1, wherein the PCB component cover is coupled to the PCB via an adhesive. ### Claim 8 A system for protecting components on a printed circuit board (PCB) comprising: a number of slots for connecting add-in cards to the PCB; a number of electronic components on the PCB adjacent to the number of slots; a polycarbonate sheet, the polycarbonate sheet being formed to match a gross contour of the number of components coupled to the PCB adjacent to the number of slots; and a number of fasteners to couple the polycarbonate sheet to the PCB as a cover over the number of components having a gross contour matched to the polycarbonate sheet; wherein the polycarbonate sheet further comprises: a field of perforations to facilitate cooling of components on the PCB, the perforations arranged in a regular pattern over a surface of the polycarbonate sheet and a number of apertures through each of which a respective component on the PCB extends when the cover is in place on the PCB. ### Claim 9 A method of protecting a printed circuit board (PCB), comprising: determining a gross contour of a number of components coupled to the PCB; thermoforming a polycarbonate sheet based on the determined gross contour; and attaching the polycarbonate sheet to the PCB via an interference fit between the polycarbonate sheet and the components coupled to the PCB wherein attaching the polycarbonate sheet to the PCB comprises: die-cutting a number of holes in the polycarbonate sheet in positions where a corresponding number of PCB standoff screws are located on the PCB, the correspondence being based on a position the polycarbonate sheet is to be placed on the PCB; removing the PCB standoff screws from the PCB; and attaching the polycarbonate sheet to the PCB using the removed PCB standoff screws. ### Claim 10 (depends on 9) The method of claim 9, further comprising die cutting a number of perforations in the polycarbonate sheet. ### Claim 11 (depends on 9) The method of claim 9, wherein thermoforming a polycarbonate sheet based on the determined gross contour comprises thermoforming the polycarbonate sheet using vacuum molding, injection molding, blow molding, rotational molding, or combinations thereof. ### Claim 12 (depends on 9) The method of claim 9, wherein attaching the polycarbonate sheet to the PCB comprises attaching the polycarbonate sheet to the PCB using an adhesive. ### Claim 13 (depends on 1) The PCB component cover of claim 1, wherein the cover is sloped relative to the protected PCB board. ### Claim 14 (depends on 13) The PCB component cover of claim 13, further comprising a step. ### Claim 15 (depends on 8) The system of claim 8, wherein the polycarbonate sheet comprises a step. ### Claim 16 A system for protecting components on a printed circuit board (PCB) comprising: a polycarbonate sheet, the polycarbonate sheet being formed to match a gross contour of a number of components coupled to the PCB; and wherein the polycarbonate sheet attaches via interference fit at a slope relative to the PCB; and wherein the polycarbonate sheet further comprises: a field of perforations to facilitate cooling of components on the PCB, the perforations arranged in a regular pattern over a surface of the polycarbonate sheet; a number of apertures through each of which a respective component on the PCB extends when the polycarbonate sheet is in place as a cover on the PCB. ### Claim 17 (depends on 8) The system of claim 8, wherein at least one of the apertures is completely surrounded by the field of perforations. ### Claim 18 (depends on 8) The system of claim 8, wherein the number of fasteners are points of interference fit between the sheet and components of the PCB.