# US 10,771,666 B2 · Image capturing module and electrical support thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,771,666 B2 - Document ID: US10771666B2 - Status: Granted - Kind: B2 - Application number: 15/780,534 - Filed: 2016-12-01 - Published: 2019-01-17 - Granted: 2020-09-08 - Earliest claimed: 2015-12-01 - Assignees: Ningbo Sunny Opotech Co., Ltd. - Applicants: Ningbo Sunny Opotech Co., Ltd. - Inventors: Mingzhu Wang; Baozhong Zhang; Zhen Huang; Feifan Chen; Nan Guo; Zhenyu Chen; Ye Wu - Web page: https://patentgrep.com/patent/US10771666B2 ## CPC - G03B 17/561: {Support related camera accessories} - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - G02B 7/04: with mechanism for focusing or varying magnification - G03B 17/02: Bodies - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H05K 3/303: with surface mounted components (H05K3/32 takes precedence) - H05K 3/341: Surface mounted components - G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D) - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract The present disclosure provides a camera module and an electrical bracket thereof. The electrical bracket is provided with a clear aperture. The electrical bracket not only has the functions of a conventional circuit board (conduction of the electrical signal of an electronic device such as a chip and a motor), but also has the effects of a conventional base to support an optical filter and serve as a motor base bracket. ## Claims ### Claim 1 A camera module, comprising: a lens assembly; a motor; a photosensitive chip; an electrical bracket comprising a bracket body and a circuit, wherein the circuit is embedded inside the bracket body and comprises a plurality of electrical elements embedded inside the bracket body, wherein at least one photosensitive chip connecting device is disposed on the electrical bracket, and at least one motor connecting device is disposed on the electrical bracket, wherein the lens assembly is located on a photosensitive path of the photosensitive chip, wherein the electrical bracket provides a support to the motor via the motor connecting device and provides a support to the photosensitive chip via the photosensitive chip connecting device, the circuit embedded inside the electrical bracket is conductively connected to the photosensitive chip connecting device and the motor connecting device, and implements an electrical conduction to the photosensitive chip and the motor. ### Claim 2 (depends on 1) The camera module according to claim 1, wherein the photosensitive chip connecting device is specifically implemented as a metal body grown on the photosensitive chip. ### Claim 3 (depends on 2) The camera module according to claim 2, wherein a material of the photosensitive chip connecting device is selected from a group consisting of gold, copper, gold copper alloy and tin-nickel alloy. ### Claim 4 (depends on 2) The camera module according to claim 2, wherein the photosensitive chip connecting device is specifically implemented as a copper pillar. ### Claim 5 (depends on 2) The camera module according to claim 2, further comprising a circuit board, wherein the photosensitive chip is conductively connected to the circuit board through the photosensitive chip connecting device. ### Claim 6 (depends on 5) The camera module according to claim 5, wherein the photosensitive chip having the photosensitive chip connecting device is formed by cutting a photosensitive chip wafer after forming the photosensitive chip wafer having a series of the photosensitive chip connecting devices. ### Claim 7 (depends on 1) The camera module according to claim 1, wherein the photosensitive chip connecting device comprises a connecting element and a conducting element, the connecting element is preset on a surface of the photosensitive chip, and the conducting element is conductively and firmly disposed on the connecting element and protrudes from the connecting element. ### Claim 8 (depends on 7) The camera module according to claim 7, wherein the conducting element is specifically implemented as a metal body grown on the connecting element disposed on the photosensitive chip. ### Claim 9 (depends on 8) The camera module according to claim 8, wherein the conducting element is specifically implemented as a metal cylinder of the connecting element plated on the photosensitive chip. ### Claim 10 An electrical bracket having at lease two connecting device and applied to a camera module comprising a motor and a photosensitive chip, wherein the electrical bracket provides a support to the motor and the photosensitive chip and comprises: a bracket body; and a circuit, wherein the circuit is embedded inside the bracket body and comprises a plurality of electrical elements embedded inside the bracket body, wherein the connecting device comprises photosensitive chip connecting device and motor connecting device disposed on the electrical bracket, wherein the motor connecting device conductively connects the circuit to the motor and the photosensitive chip connecting device conductively connects the circuit to the photosensitive chip, so as to implement an electric conduction to the photosensitive chip and the motor of the camera module. ### Claim 11 (depends on 10) The electrical bracket according to claim 10, wherein the photosensitive chip connecting device is specifically implemented as a metal body grown on the electrical bracket and protrudes from the electrical bracket. ### Claim 12 (depends on 11) The electrical bracket according to claim 11, wherein the photosensitive chip connecting device comprises a metal cylinder plated on the electrical bracket. ### Claim 13 (depends on 12) The electrical bracket according to claim 12, wherein a material of the metal cylinder is selected from a group consisting of gold, copper, gold copper alloy and tin-nickel alloy. ### Claim 14 (depends on 13) The electrical bracket according to claim 13, wherein the metal cylinder is specifically implemented as a copper pillar.