# US 10,771,037 B2 · Piezoelectric resonator device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,771,037 B2 - Document ID: US10771037B2 - Status: Granted - Kind: B2 - Application number: 15/561,037 - Filed: 2016-02-05 - Published: 2018-03-15 - Granted: 2020-09-08 - Earliest claimed: 2015-03-27 - Assignees: Daishinku Corporation - Applicants: Daishinku Corporation - Inventors: Takuya Kojo; Satoru Ishino - Web page: https://patentgrep.com/patent/US10771037B2 ## CPC - H03H 9/02015: {Characteristics of piezoelectric layers, e.g. cutting angles} - H03H 9/0547: {consisting of a vertical arrangement (H03H9/0566 takes precedence)} - H03H 9/0595: {the holder support and resonator being formed in one body} - H03H 9/1035: {the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device} - H03H 9/173: {Air-gaps} - H10N 30/076: by vapour phase deposition - H10N 30/079: using intermediate layers, e.g. for growth control - H10N 30/877: {Conductive materials} - H10W 76/12: characterised by their shape - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A piezoelectric resonator device having a sandwich structure is provided, which is stably bonded to an external element. In the piezoelectric resonator device 1, at least a vibrating part 21 of a piezoelectric substrate 2 is sealed by a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 includes: the vibrating part 21; and an external frame part 23 that is thicker than the vibrating part 21 and that surrounds the outer periphery of the vibrating part 21. External electrodes 31 to be connected to an external element 5 are provided on at least one of the first sealing member 3 and the second sealing member 4. The external element 5 is connected to the external electrodes 31 at least on the external frame part 23 of the piezoelectric substrate 2. ## Claims ### Claim 1 A piezoelectric resonator device, comprising: a piezoelectric substrate including a vibrating part configured to piezoelectrically vibrate by application of a voltage and an external frame part thicker than the vibrating part and which surrounds an outer periphery of the vibrating part; a first sealing member covering a first main surface of the piezoelectric substrate so as to seal the vibrating part; a second sealing member covering a second main surface of the piezoelectric substrate so as to seal the vibrating part; a first excitation electrode and a second excitation electrode on the vibrating part of the piezoelectric substrate; and external electrodes on at least one of the first sealing member and the second sealing member, the external electrodes being connected to an external element, and wherein the external element is connected to the external electrodes at least on the external frame part of the piezoelectric substrate, wherein a first external electrode is connected to the first excitation electrode and a second external electrode is connected to the second excitation electrode in the absence of castellation, wherein the external electrodes are connected to the external element via metal bumps, wherein the external electrodes include at least an external electrode for a first excitation electrode and an external electrode for a second excitation electrode connected respectively to a pair of first excitation electrode and second excitation electrode formed on the vibrating part of the piezoelectric substrate, wherein only the metal bump connecting the external electrode for the first excitation electrode to the external element is disposed at a position superimposed to a first wiring connecting the first excitation electrode to the external electrode for the first excitation electrode in plan view, and wherein only the metal bump connecting the external electrode for the second excitation electrode to the external element is disposed at a position superimposed to a wiring connecting the second excitation electrode to the external electrode for the second excitation electrode in plan view. ### Claim 2 (depends on 1) The piezoelectric resonator device according to claim 1, further comprising other external electrodes not connected to the first excitation electrode and the second excitation electrode, and wherein the other external electrodes are disposed at positions not superimposed, in plan view, to: a first wiring connecting the first excitation electrode to the external electrode for the first excitation electrode; and a second wiring connecting the second excitation electrode to the external electrode for the second excitation electrode. ### Claim 3 (depends on 2) The piezoelectric resonator device according to claim 2, wherein the external electrode for the first excitation electrode is disposed at a position not superimposed to the second wiring in plan view, and wherein the external electrode for the second excitation electrode is disposed at a position not superimposed to the first wiring in plan view. ### Claim 4 (depends on 1) The piezoelectric resonator device according to claim 1, wherein the external electrode for the first excitation electrode and the external electrode for the second excitation electrode are formed at respective positions corresponding to the external frame part of the piezoelectric substrate in plan view, and wherein the external electrode for the first excitation electrode and the external electrode for the second excitation electrode are used as test terminals for the vibrating part of the piezoelectric substrate. ### Claim 5 (depends on 1) The piezoelectric resonator device according to claim 1, wherein the external electrode for the first excitation electrode and the external electrode for the second excitation electrode are formed at respective positions corresponding to the external frame part of the piezoelectric substrate in plan view, and wherein the external electrode for the first excitation electrode and the external electrode for the second excitation electrode are used as test terminals for the vibrating part of the piezoelectric substrate. ### Claim 6 (depends on 1) The piezoelectric resonator device according to claim 1, wherein the external electrodes are formed on the first sealing member, and the external element is an IC. ### Claim 7 A piezoelectric resonator device, comprising: a piezoelectric substrate including a vibrating part configured to piezoelectrically vibrate by application of a voltage; a first sealing member covering a first main surface of the piezoelectric substrate so as to seal the vibrating part; and a second sealing member covering a second main surface of the piezoelectric substrate so as to seal the vibrating part, the piezoelectric resonator device being configured to seal at least the vibrating part of the piezoelectric substrate by the first sealing member and the second sealing member, wherein the piezoelectric substrate includes: the vibrating part; and an external frame part configured to be thicker than the vibrating part and to surround an outer periphery of the vibrating part, wherein external electrodes are provided on at least one of the first sealing member and the second sealing member, the external electrodes being connected to an external element via metal bumps at least on the external frame part of the piezoelectric substrate, wherein the external electrodes include at least an external electrode for a first excitation electrode and an external electrode for a second excitation electrode connected respectively to a pair of first excitation electrode and second excitation electrode formed on the vibrating part of the piezoelectric substrate, wherein only the metal bump connecting the external electrode for the first excitation electrode to the external element is disposed at a position superimposed to a first wiring connecting the first excitation electrode to the external electrode for the first excitation electrode in plan view, and wherein only the metal bump connecting the external electrode for the second excitation electrode to the external element is disposed at a position superimposed to a wiring connecting the second excitation electrode to the external electrode for the second excitation electrode in plan view. ### Claim 8 A piezoelectric resonator device, comprising: a piezoelectric substrate including a vibrating part configured to piezoelectrically vibrate by application of a voltage; a first sealing member covering a first main surface of the piezoelectric substrate so as to seal the vibrating part; and a second sealing member covering a second main surface of the piezoelectric substrate so as to seal the vibrating part, the piezoelectric resonator device being configured to seal at least the vibrating part of the piezoelectric substrate by the first sealing member and the second sealing member, wherein the piezoelectric substrate includes: the vibrating part; and an external frame part configured to be thicker than the vibrating part and to surround an outer periphery of the vibrating part, wherein external electrodes are provided on at least one of the first sealing member and the second sealing member, the external electrodes being connected to an external element, and wherein the external element is connected to the external electrodes at least on the external frame part of the piezoelectric substrate, and wherein the external electrodes include, at least: an external electrode for a first excitation electrode and an external electrode for a second excitation electrode connected respectively to a pair of first excitation electrode and second excitation electrode formed on the vibrating part of the piezoelectric substrate; and other electrodes not connected to the first excitation electrode and the second excitation electrode, and wherein the other external electrodes are disposed at positions not superimposed, in plan view, to: a first wiring connecting the first excitation electrode to the external electrode for the first excitation electrode; and a second wiring connecting the second excitation electrode to the external electrode for the second excitation electrode. ### Claim 9 (depends on 8) The piezoelectric resonator device according to claim 8, wherein the external electrode for the first excitation electrode is disposed at a position not superimposed to the second wiring in plan view, and wherein the external electrode for the second excitation electrode is disposed at a position not superimposed to the first wiring in plan view. ### Claim 10 (depends on 7) The piezoelectric resonator device according to claim 7, wherein the external electrode for the first excitation electrode and the external electrode for the second excitation electrode are formed at respective positions corresponding to the external frame part of the piezoelectric substrate in plan view, and wherein the external electrode for the first excitation electrode and the external electrode for the second excitation electrode are used as test terminals for the vibrating part of the piezoelectric substrate. ### Claim 11 (depends on 1) The piezoelectric resonator device according to claim 1, wherein the first external electrode and the second external electrode are connected to the first excitation electrode and the second external electrode respectively via holes that are not at the edges of the first sealing member and second sealing member. ### Claim 12 (depends on 11) The piezoelectric resonator device according to claim 11, wherein the holes are perpendicular to the first and second sealing members.