# US 10,770,954 B2 · Interference suppression apparatus, electronic subassembly, and use of an interference suppression apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,954 B2 - Document ID: US10770954B2 - Status: Granted - Kind: B2 - Application number: 16/065,041 - Filed: 2016-11-28 - Published: 2019-02-28 - Granted: 2020-09-08 - Earliest claimed: 2015-12-21 - Assignees: Robert Bosch GmbH - Applicants: Robert Bosch GmbH - Inventors: Dennis Burger - Web page: https://patentgrep.com/patent/US10770954B2 ## CPC - H02K 11/0141: {Shields associated with casings, enclosures or brackets} - H02K 7/006: {Structural association of a motor or generator with the drive train of a motor vehicle} - H02K 11/02: for suppression of electromagnetic interference - H02K 11/33: Drive circuits, e.g. power electronics (H02K11/38 takes precedence) - H02K 11/40: Structural association with grounding devices - H02M 1/44: Circuits or arrangements for compensating for electromagnetic interference in converters or inverters - H02M 7/003: {Constructional details, e.g. physical layout, assembly, wiring or busbar connections} - H02M 1/126: {using passive filters} - H02K: DYNAMO-ELECTRIC MACHINES (dynamo-electric relays H01H53/00; conversion of DC or AC input power into surge output power {H03K3/53}) - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) ## Abstract The invention relates to an interference suppression apparatus (100) for an electronic component, having a positive high-voltage pole (108) and a negative high-voltage pole (109), having at least one capacitance module (101; 101′, 101″) with in each case at least one first capacitor (103), via which the positive high-voltage pole (108) is connected to earth, and at least one second capacitor (104), via which the negative high-voltage pole (109) is connected to earth, and at least one third capacitor (107) which is connected between the positive high-voltage pole (108) and the negative high-voltage pole (109); and/or at least one inductance module (102) with in each case at least one common-mode inductor (112) which is wound around the positive high-voltage pole (108) and the negative high-voltage pole (109); wherein the capacitance modules (101; 101′, 101″) and/or inductance modules (102) are connected in series. ## Claims ### Claim 1 An interference suppression apparatus (100) for an electronic subassembly having a positive high-voltage pole (108) and a negative high-voltage pole (109), the interference suppression apparatus comprising at least one capacitance module (101; 101′, 101″), with in each case at least one first capacitor (103) via which the positive high-voltage pole (108) is connected to ground, at least one second capacitor (104) via which the negative high-voltage pole (109) is connected to ground, and at least one third capacitor (107) which is connected between the positive high-voltage pole (108) and the negative high-voltage pole (109); and at least one inductance module (102) having in each case at least one common-mode choke (112) wound around the positive high-voltage pole (108) and the negative high-voltage pole (109); wherein the at least one capacitance module (101; 101′, 101″) comprises a capacitance module housing (601) for electromagnetic screening, wherein the capacitance module housing (601) houses the at least one first capacitor (103), the at least one second capacitor (104) and the at least one third capacitor (107); wherein the positive high-voltage pole (108) and the negative high-voltage pole (109) are arranged outside the capacitance module housing (601); and wherein an electrically insulating and thermally conductive layer (401) is formed on a face of the positive high-voltage pole (108) and of the negative high-voltage pole (109) facing away from the capacitance module housing (601). ### Claim 2 (depends on 1) The interference suppression apparatus (100) as claimed in claim 1, wherein the common-mode choke (112) of the at least one inductance module (102) is additionally wound around a magnetic core (113) arranged between the positive high-voltage pole (108) and the negative high-voltage pole (109). ### Claim 3 (depends on 1) A vehicle comprising the interference suppression apparatus as claimed in claim 1, and an electric drivetrain with an inverter (110) and an electric motor (111), wherein the positive high-voltage pole (108) and the negative high-voltage pole (109) are connected to the inverter (110). ### Claim 4 (depends on 1) The interference suppression apparatus (100) as claimed in claim 1, wherein the at least one capacitance module (101; 101′, 101″) and the at least one inductance module (102) are connected in series. ### Claim 5 (depends on 1) The interference suppression apparatus (100) as claimed in claim 1, wherein the at least one first capacitor (103) of the at least one capacitance module (101; 101′, 101″) is connected to ground via a first damping resistor (105), and wherein the at least one second capacitor (104) of the at least one capacitance module (101; 101′, 101″) is connected to ground via a second damping resistor (106). ### Claim 6 (depends on 1) The interference suppression apparatus (100) as claimed in claim 1, wherein contacts (305, 306) of the at least one first capacitor (103) and/or of the at least one second capacitor (104) and/or of the at least one third capacitor (107) of the at least one capacitance module (101; 101′, 101″) are connected to the positive high-voltage pole (108) and/or the negative high-voltage pole (109) by screwing and/or clamping and/or plugging in and/or welding. ### Claim 7 (depends on 1) The interference suppression apparatus (100) as claimed in claim 1, wherein the at least one inductance module (102) comprises an inductance module housing for electromagnetic screening, which houses the at least one common-mode choke (112). ### Claim 8 (depends on 7) The interference suppression apparatus (100) as claimed in claim 7, wherein the inductance module housings and/or capacitance module housings (601) can be connected to one another by screwing and/or clamping and/or plugging in and/or welding. ### Claim 9 (depends on 1) The interference suppression apparatus (100) as claimed in claim 1, wherein the at least one capacitance module (101; 101′, 101″) and an additional capacitance module (101; 101′, 101″) are connected in series. ### Claim 10 (depends on 1) The interference suppression apparatus (100) as claimed in claim 1, the at least one inductance module (102) and an additional inductance module (102) are connected in series. ### Claim 11 An interference suppression apparatus (100) for an electronic subassembly having a positive high-voltage pole (108) and a negative high-voltage pole (109), the interference suppression apparatus comprising at least one capacitance module (101; 101′, 101″), with in each case at least one first capacitor (103) via which the positive high-voltage pole (108) is connected to ground, at least one second capacitor (104) via which the negative high-voltage pole (109) is connected to ground, and at least one third capacitor (107) which is connected between the positive high-voltage pole (108) and the negative high-voltage pole (109); wherein the at least one capacitance module (101; 101′, 101″) comprises a capacitance module housing (601) for electromagnetic screening, wherein the capacitance module housing (601) houses the at least one first capacitor (103), the at least one second capacitor (104) and the at least one third capacitor (107), wherein the positive high-voltage pole (108) and the negative high-voltage pole (109) are arranged outside the capacitance module housing (601); and wherein an electrically insulating and thermally conductive layer (401) is formed on a face of the positive high-voltage pole (108) and of the negative high-voltage pole (109) facing away from the capacitance module housing (601). ### Claim 12 (depends on 11) The interference suppression apparatus (100) as claimed in claim 11, wherein the at least one first capacitor (103) of the at least one capacitance module (101; 101′, 101″) is connected to ground via a first damping resistor (105), and wherein the at least one second capacitor (104) of the at least one capacitance module (101; 101′, 101″) is connected to ground via a second damping resistor (106). ### Claim 13 (depends on 11) The interference suppression apparatus (100) as claimed in claim 11, wherein contacts (305, 306) of the at least one first capacitor (103) and/or of the at least one second capacitor (104) and/or of the at least one third capacitor (107) of the at least one capacitance module (101; 101′, 101″) are connected to the positive high-voltage pole (108) and/or the negative high-voltage pole (109) by screwing and/or clamping and/or plugging in and/or welding. ### Claim 14 An interference suppression apparatus (100) for an electronic subassembly having a positive high-voltage pole (108) and a negative high-voltage pole (109), the interference suppression apparatus comprising at least one inductance module (102) having in each case at least one common-mode choke (112) wound around the positive high-voltage pole (108) and the negative high-voltage pole (109); wherein the at least one common-mode choke (112) of the at least one inductance module (102) is additionally wound around a magnetic core (113) arranged between the positive high-voltage pole (108) and the negative high-voltage pole (109). ### Claim 15 (depends on 14) The interference suppression apparatus (100) as claimed in claim 14, wherein the at least one inductance module (102) comprises an inductance module housing for electromagnetic screening, which houses the at least one common-mode choke (112). ### Claim 16 (depends on 15) The interference suppression apparatus (100) as claimed in claim 15, wherein the at least one inductance module housings can be connected to another at least one inductance module housing by screwing and/or clamping and/or plugging in and/or welding. ### Claim 17 An electronic subassembly (700; 800), having a positive high-voltage pole (108) and a negative high-voltage pole (109), and at least one interference suppression apparatus (100), the interference suppression apparatus (100) comprising at least one capacitance module (101; 101′, 101″), with in each case at least one first capacitor (103) via which the positive high-voltage pole (108) is connected to ground, at least one second capacitor (104) via which the negative high-voltage pole (109) is connected to ground, and at least one third capacitor (107) which is connected between the positive high-voltage pole (108) and the negative high-voltage pole (109); wherein the electronic subassembly comprises a housing (402); and wherein the positive high-voltage pole (108) is connected to ground via the at least one first capacitor (103) of the at least one capacitance module (101; 101′, 101″) via a contact with the housing (402); and wherein the negative high-voltage pole (109) is connected to ground via the at least one second capacitor (104) of the at least one capacitance module (101; 101′, 101″) via a contact with the housing (402).