# US 10,770,855 B2 · Terminal, board connector, board with connector and terminal production method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,855 B2 - Document ID: US10770855B2 - Status: Granted - Kind: B2 - Application number: 16/557,964 - Filed: 2019-08-30 - Published: 2020-03-05 - Granted: 2020-09-08 - Earliest claimed: 2018-09-03 - Assignees: Sumitomo Wiring Systems, Ltd. - Applicants: Sumitomo Wiring Systems, Ltd. - Inventors: Yuichi Nakanishi; Hidekazu Matsuda; Hiroto Sakai - Web page: https://patentgrep.com/patent/US10770855B2 ## CPC - H01R 12/57: surface mounting terminals - H01R 43/0256: {for soldering or welding connectors to a printed circuit board} - H01R 12/714: {with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit} - H01R 12/716: {Coupling device provided on the PCB} - H01R 43/16: for manufacturing contact members, e.g. by punching and by bending - H01R 43/24: Assembling by moulding on contact members - H05K 3/3426: {characterised by the leads} - H05K 3/4661: {Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K3/387)} - H05K 13/04: Mounting of components {, e.g. of leadless components} - H01R 12/724: {containing contact members forming a right angle} - H01R 13/03: characterised by the material, e.g. plating, or coating materials - H01R 13/41: by frictional grip in grommet, panel or base - H05K 2201/10189: Non-printed connector - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract It is aimed to provide a terminal capable of realizing a cost reduction while maintaining solder wettability. The terminal has a board connecting portion to be connected to a circuit board, and includes a base and a plating layer. The base has a plated surface covered by the plating layer and an exposed surface. The plating layer on the board connecting portion has a first inclined surface for covering a slope connecting the plated surface and the exposed surface. ## Claims ### Claim 1 A terminal with a board connecting portion to be connected to a circuit board, comprising: a base; and a plating layer; wherein: the base has a plated surface covered by the plating layer and an exposed surface; the plating layer has a first inclined surface for covering a slope connecting the plated surface and the exposed surface in the board connecting portion; the board connecting portion has a rising surface rising at an angle from the exposed surface; the rising surface exposes the base; and the plating layer has a second inclined surface for covering a slope connecting the plated surface and the rising surface. ### Claim 2 (depends on 1) The terminal of claim 1, wherein the plating layer contains Sn. ### Claim 3 (depends on 1) The terminal of claim 1, comprising a nonlinear part. ### Claim 4 (depends on 1) The terminal of claim 1, wherein a thickness of the base is 0.05 mm or more and 0.80 mm or less. ### Claim 5 (depends on 1) A board connector, comprising: the terminal of claim 1; and a connector housing for holding the terminal. ### Claim 6 (depends on 5) A board with connector, comprising: the board connector of claim 5; a circuit board on which the board connector is mounted; and solder for connecting the circuit board and the board connecting portion; the exposed surface being arranged to face the circuit board. ### Claim 7 (depends on 6) The board with connector of claim 6, wherein the exposed end surface is embedded in the solder. ### Claim 8 A terminal production method for producing a terminal, comprising: providing a plate material having opposite first and second surfaces applying plating to form first and second plating layers respectively on the first and second surfaces of the plate material to obtain a plated plate; stamping the plated plate to obtain a terminal piece having the first and second plated surfaces and an exposed surface extending between the first and second plated surfaces; and rolling the terminal piece at areas of the first and second plating layers adjacent the exposed surface to form first and second inclined plated surface areas that are inclined toward the exposed surface. ### Claim 9 (depends on 8) The terminal production method of claim 8, wherein a plating process is electroplating. ### Claim 10 A terminal (30) with a board connecting portion (31) to be connected to a circuit board (10), comprising: a base (41) including: a first non-inclined surface (42A1) and a second non-inclined surface (4261) facing oppositely from one another, first inclined surfaces (42A2, 42A3, 42A4) extending from the first non-inclined surface (42A1) and second inclined surfaces (4262, 4263, 4263) extending from the second non-inclined surfaces (4261), and end surfaces (43A, 43B, 43C) extending from the first inclined surfaces (42A2, 42A3, 42A4) to the second inclined surfaces (42B2, 42B3, 42B3); and a plating layer (44A, 44B) covering the base (41) across the first and second non-inclined surfaces (42A1, 42B1) and the first and second inclined surfaces (42A2, 42A3, 42A4; 42B2, 42B3, 42B3); wherein: the base (41) is exposed at the end surfaces (43A, 43B, 43C) between the first inclined surfaces (42A2, 42A3, 42A4) and the second inclined surfaces (42B2, 42B3, 42B3); and at least a first of the exposed end surfaces (43A) defines a part of the board connecting portion (31) that is to be connected to a circuit board (10). ### Claim 11 (depends on 1) The terminal of claim 1, comprising a nonlinear part extending from the board connecting portion. ### Claim 12 (depends on 1) The terminal of claim 1, wherein a thickness of the base is 0.05 mm or more and 0.80 mm or less.