# US 10,770,795 B2 · Antenna device and method for manufacturing antenna device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,795 B2 - Document ID: US10770795B2 - Status: Granted - Kind: B2 - Application number: 15/245,022 - Filed: 2016-08-23 - Published: 2017-11-30 - Granted: 2020-09-08 - Earliest claimed: 2016-05-27 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Co., Ltd. - Inventors: Chuei-Tang Wang; Chung-Hao Tsai; Jeng-Shien Hsieh; Wei-Heng Lin; Kuo-Chung Yee; Chen-Hua Yu - Web page: https://patentgrep.com/patent/US10770795B2 ## CPC - H01Q 9/065: {Microstrip dipole antennas (patch antenna H01Q9/0407)} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/36: Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith}(H01Q1/08, H01Q1/14 take precedence) - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 3/24: varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching - H10W 44/248: {for antennas} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 72/073: {of die-attach connectors} - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/874: {On different surfaces} - H10W 72/9413: {on encapsulations} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die. ## Claims ### Claim 1 An antenna device, comprising: a package comprising at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die; and at least one antenna comprising at least one conductor at least partially in the molding compound and operatively connected to the RF die, and comprising a director in the molding compound, wherein the at least one conductor has a bottom surface substantially coplanar with a bottom surface of the director, and the conductor comprises a first radiating element at least partially in the molding compound, the antenna comprises at least one first ground element, and the first radiating element is present between the first ground element and the director. ### Claim 2 (depends on 1) The antenna device of claim 1, wherein a thickness of the molding compound and a thickness of the conductor are substantially the same. ### Claim 3 (depends on 1) The antenna device of claim 1, wherein the conductor is a conductive wall in the molding compound. ### Claim 4 (depends on 1) The antenna device of claim 1, wherein the antenna is a dipole antenna. ### Claim 5 (depends on 1) The antenna device of claim 1, wherein a top-view shape of the conductor of the antenna is substantially L-shaped. ### Claim 6 (depends on 1) The antenna device of claim 1, wherein the director is spaced from the first radiating element by at least a portion of the molding compound. ### Claim 7 (depends on 1) The antenna device of claim 1, wherein the first ground element is spaced from the first radiating element by at least a portion of the molding compound. ### Claim 8 (depends on 1) The antenna device of claim 1, further comprising: at least one first dielectric layer over the RF die and the molding compound; at least one feeding line present in the first dielectric layer and electrically connected to the RF die; at least one second ground element present in the first dielectric layer and having at least one aperture therein; at least one second dielectric layer over the second ground element; and at least one second radiating element present on the second dielectric layer, wherein the second radiating element is operatively connected to the RF die. ### Claim 9 (depends on 1) The antenna device of claim 1, further comprising: a thermal plate thermally coupled with the RF die. ### Claim 10 (depends on 9) The antenna device of claim 9, further comprising: at least one thermally conductive bump thermally coupled with the thermal plate. ### Claim 11 (depends on 1) The antenna device of claim 1, further comprising: at least one redistribution layer electrically connecting the RF die and the conductor of the antenna. ### Claim 12 (depends on 1) The antenna device of claim 1, further comprising: a redistribution layer above the first ground element. ### Claim 13 An antenna device, comprising: a package comprising at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die; at least one first dielectric layer over the RF die and the molding compound; at least one feeding line present in the first dielectric layer and electrically connected to the RF die; at least one ground element present in the first dielectric layer and having at least one aperture therein; at least one second dielectric layer over the ground element, wherein the second dielectric layer and the molding compound are made of different materials; and at least one radiating element present on the second dielectric layer, wherein the radiating element is operatively connected to the RF die. ### Claim 14 (depends on 13) The antenna device of claim 13, wherein there is no solder bump between the RF die and the radiating element. ### Claim 15 (depends on 13) The antenna device of claim 13, further comprising: at least one third dielectric layer over the radiating element; and at least one director present on the third dielectric layer. ### Claim 16 (depends on 13) The antenna device of claim 13, wherein a projection of the radiating element on the ground element overlaps with the aperture of the ground element. ### Claim 17 A method for manufacturing an antenna device, the method comprising: forming an opening in a photo resist on a buffer layer; forming at least one radiating element in the opening of the photo resist and on the buffer layer; removing the photo resist; disposing at least one radio frequency (RF) die on the buffer layer; forming a molding compound that surrounds the RF die and the radiating element; forming a redistribution layer above the radiating element; forming a first dielectric layer and a ground element over the RF die and the molding compound, wherein the ground element is in the first dielectric layer; and forming a second dielectric layer over the ground element, wherein the second dielectric layer and the molding compound are made of different materials. ### Claim 18 (depends on 17) The method of claim 17, further comprising: forming at least one thermal plate on the buffer layer, wherein the RF die is disposed on the thermal plate. ### Claim 19 (depends on 17) The method of claim 17, wherein forming the redistribution layer is such that the redistribution layer electrically connects the RF die and the radiating element. ### Claim 20 (depends on 17) The method of claim 17, wherein forming the redistribution layer is performed after forming the molding compound.