# US 10,770,777 B2 · Foil laminate intermediate and method of manufacturing

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- Number: US 10,770,777 B2
- Document ID: US10770777B2
- Status: Granted
- Kind: B2
- Application number: 14/064,873
- Filed: 2013-10-28
- Published: 2014-02-20
- Granted: 2020-09-08
- Earliest claimed: 2010-06-14
- Assignees: Avery Dennison Corporation
- Applicants: Avery Dennison Corporation
- Inventors: Ian James Forster; Peter Cockerell; Norman Howard
- Web page: https://patentgrep.com/patent/US10770777B2

## CPC

- H01P 11/003: {Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines}
- B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove
- B32B 38/10: Removing layers, or parts of layers, mechanically or chemically
- G06K 19/0723: {the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs}
- G06K 19/07718: {the record carrier being manufactured in a continuous process, e.g. using endless rolls}
- G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card}
- G06K 19/0775: {arrangements for connecting the integrated circuit to the antenna}
- G06K 19/07754: {the connection being galvanic}
- G06K 19/07786: {the antenna being of the HF type, such as a dipole}
- B32B 37/12: characterised by using adhesives
- B32B 38/145: {Printing}
- B32B 2305/10: Fibres of continuous length
- B32B 2307/302: Conductive
- B32B 2317/12: Paper, e.g. cardboard
- B32B 2519/02: RFID tags
- Y10T 29/49016: Antenna or wave energy "plumbing" making
- Y10T 29/49018: with other electrical component
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/49156: with selective destruction of conductive paths
- Y10T 29/5317: Laminated device
- Y10T 29/53174: Means to fasten electrical component to wiring board, base, or substrate
- Y10T 156/1052: with cutting, punching, tearing or severing
- Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T 428/24917: including metal layer
- Y10T 428/2809: including irradiated or wave energy treated component
- Y10T 428/2817: Heat sealable
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

## Claims

### Claim 1

A method of making a conductive metal foil laminate, comprising the steps of:
providing a substrate having first and second sides;
applying an adhesive pattern to the first side of the substrate;
providing a metal foil having first and second sides such that the second side of the foil is in contact with the adhesive;
cutting with a first cutter a first pattern in the metal foil coincident with the adhesive pattern to create a first conductive foil pattern and a matrix, where the cutting by the first cutter comprises performing a partial die cut using a mechanical cutter or a laser cutter;
feeding the substrate having metal foil and adhesive into a second cutter;
cutting a second pattern with the second cutter in the metal foil to create a second conductive foil pattern coincident with the first pattern to create an opening in the second pattern in which no metal foil exists in the opening such that the cutting of the second pattern is accomplished by ablation with a laser and the laser does not score or mark the substrate and both the metal foil and adhesive pattern beneath cut areas of the metal foil are ablated;
removing the matrix from the first conductive foil pattern; and
feeding the substrate into a third cutter to make modifications to the first or second conductive foil pattern.

### Claim 2 (depends on 1)

The method as recited in claim 1, wherein the adhesive includes an optical brightener.

### Claim 3 (depends on 1)

The method as recited in claim 1, including a further step of deadening portions of the adhesive in areas outside of the first and second patterns in the metal foil after the step of applying the adhesive.

### Claim 4 (depends on 1)

The method as recited in claim 1, wherein the first pattern in the metal foil is created with a 100 micron trace.

### Claim 5 (depends on 2)

The method of claim 2, wherein the optical brighteners are provided in a pattern only in areas where the first and second pattern in the metal foil is cut.

### Claim 6 (depends on 1)

The method of claim 1, wherein the first and second patterns are used in at least one of a radio frequency identification device, photovoltaic module or electronic circuit.

### Claim 7

A method of making a conductive metal foil laminate, comprising the steps of:
providing a paper substrate having first and second sides;
applying a permanent pressure sensitive adhesive pattern to the first side of the substrate;
providing a metal foil having first and second sides such that the second side of the foil is in contact with the adhesive;
cutting a first pattern using a first laser cutter in the metal foil coincident with the adhesive pattern to create a first conductive foil pattern and a matrix, where the cutting by the first cutter includes performing a partial die cut using a laser cutter such that the first pattern in the metal foil is created;
cutting a second pattern in the metal foil with a second cutter to create a second conductive foil pattern with fiducials to provide for alignment of an integrated circuit, the second conductive foil patterns is coincident with the first pattern and an opening is created in the second pattern in which no metal foil exists in the opening and the adhesive pattern beneath cut areas of the metal foil is ablated;
removing the matrix from the first conductive foil pattern;
collecting the substrate with first and second metal foil patterns by winding onto a roll; and
feeding the substrate into a third cutter to make modifications to the first or second conductive foil pattern.

### Claim 8 (depends on 7)

The method of claim 7, wherein the adhesive includes an optical brightener.

### Claim 9 (depends on 7)

The method of claim 7, further including deadening portions of the adhesive in areas outside of the first and second patterns after the step of applying the adhesive.

### Claim 10 (depends on 7)

The method of claim 7, wherein the first pattern is created with a 100 micron trace.

### Claim 11 (depends on 8)

The method of claim 8, wherein the optical brighteners are provided only in areas where the first and second patterns are cut.

### Claim 12 (depends on 7)

The method of claim 7, wherein the conductive metal foil laminate is used in at least one of a radio frequency identification device, photovoltaic module or electronic circuit.

### Claim 13 (depends on 7)

The method of claim 7, further comprising providing printed registration marks along an edge of the paper substrate.

### Claim 14 (depends on 7)

The method of claim 7, further comprising providing optical brighteners on the paper substrate to serve as registration marks.

### Claim 15 (depends on 7)

The method of claim 7, where the metal foil is bonded to a reinforcement layer.

### Claim 16 (depends on 7)

The method of claim 7, where the metal foil comprises aluminum.

### Claim 17 (depends on 1)

The method of claim 1, where the substrate comprises a paper material.

### Claim 18 (depends on 1)

The method of claim 1, where the metal foil is bonded to a reinforcement layer.

### Claim 19 (depends on 1)

The method of claim 1, where the metal foil comprises aluminum.