# US 10,770,671 B2 · Display panel, display device, and manufacturing method of the display panel

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- Number: US 10,770,671 B2
- Document ID: US10770671B2
- Status: Granted
- Kind: B2
- Application number: 16/389,196
- Filed: 2019-04-19
- Published: 2020-01-30
- Granted: 2020-09-08
- Earliest claimed: 2018-07-24
- Assignees: Boe Technology Group Co., Ltd.
- Applicants: Boe Technology Group Co., Ltd.
- Inventors: Qingchao Zhou; Shengji Yang; Qing Wang; Xiaochuan Chen
- Web page: https://patentgrep.com/patent/US10770671B2

## CPC

- H10K 59/38: comprising colour filters or colour changing media [CCM]
- H10K 50/115: comprising active inorganic nanostructures, e.g. luminescent quantum dots
- H10K 71/40: Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K 85/50: Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
- H10K 2102/331: {Nanoparticles used in non-emissive layers, e.g. in packaging layer}
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

The present disclosure provides a display panel, a display device, and a manufacturing method of the display panel. The display panel includes a light emitting unit; a color filter layer located on a light emission side of the light emitting unit; and a bonding structure located between the light emitting unit and the color filter layer configured to bond the light emitting unit and the color filter layer, wherein, the bonding structure comprises a quantum dot material for converting ultraviolet light into visible light.

## Claims

### Claim 1

A display panel, comprising:
a light emitting unit;
a color filter layer located on a light emission side of the light emitting unit; and
a bonding structure located between the light emitting unit and the color filter layer configured to bond the light emitting unit and the color filter layer,
wherein, the bonding structure comprises a quantum dot material configured to convert ultraviolet light into visible light.

### Claim 2 (depends on 1)

The display panel according to claim 1, wherein a mass percentage concentration of the quantum dot material in the bonding structure is about 0.5% to 5%.

### Claim 3 (depends on 1)

The display panel according to claim 1, wherein the quantum dot material in the bonding structure is configured to absorb visible light with a first wavelength range and convert the visible light with the first wavelength range into visible light with a second wavelength range, a color distribution proportion of the visible light with the first wavelength range is a first proportion and a color distribution proportion of the visible light with the second wavelength range is a second proportion when a mass percentage concentration of the quantum dot material is a first concentration, the color distribution proportion of the visible light with the first wavelength range is a third proportion and the color distribution proportion of the visible light with the second wavelength range is a fourth proportion when the mass percentage concentration of the quantum dot material is a second concentration, wherein the first wavelength range does not coincide with the second wavelength range, the second concentration is greater than the first concentration, the third proportion is greater than the first proportion, and the fourth proportion is less than the second proportion.

### Claim 4 (depends on 1)

The display panel according to claim 1, wherein the bonding structure comprises:
a packaging layer located on one side of the light emitting unit adjacent to the color filter layer configured to package the light emitting unit; and
a bonding layer located on one side of the packaging layer adjacent to the color filter layer,
wherein, the quantum dot material is in at least one of the packaging layer or the bonding layer.

### Claim 5 (depends on 1)

The display panel according to claim 1, wherein the bonding structure comprises:
a packaging layer located on one side of the light emitting unit adjacent to the color filter layer configured to package the light emitting unit;
a bonding layer located on one side of the packaging layer adjacent to the color filter layer; and
a quantum dot material layer comprising the quantum dot material and located between the packaging layer and the bonding layer.

### Claim 6 (depends on 1)

The display panel according to claim 1, wherein the bonding structure comprises:
a packaging layer located on one side of the light emitting unit adjacent to the color filter layer configured to package the light emitting unit;
a bonding layer located on one side of the packaging layer adjacent to the color filter layer; and
a quantum dot material layer comprising the quantum dot material and located on one side of the packaging layer adjacent to the light emitting unit.

### Claim 7 (depends on 1)

The display panel according to claim 1, wherein the quantum dot material comprises a green light quantum dot material.

### Claim 8 (depends on 1)

The display panel according to claim 1, wherein the quantum dot material comprises a thermally quenchable quantum dot material.

### Claim 9 (depends on 8)

The display panel according to claim 8, wherein a thermal quenching temperature of the thermally quenchable quantum dot material is about 60° C. to 80° C.

### Claim 10 (depends on 8)

The display panel according to claim 8, wherein the thermally quenchable quantum dot material comprises an organic-inorganic hybrid quantum dot material.

### Claim 11 (depends on 10)

The display panel according to claim 10, wherein the organic-inorganic hybrid quantum dot material comprises at least one of CH3NH3PbCl3, CH3NH3PbBr3 or CH3NH3PbI3.

### Claim 12 (depends on 1)

The display panel according to claim 1, wherein the light emitting unit comprises an organic light emitting diode device.

### Claim 13 (depends on 1)

A display device, comprising the display panel according to claims 1.

### Claim 14

A manufacturing method of a display panel, comprising:
providing a light emitting unit;
forming a bonding structure comprising a quantum dot material on a light emitting side of the light emitting unit, so as to convert ultraviolet light into visible light when the ultraviolet light is used to cure on the bonding structure; and
forming a color filter layer on one side of the bonding structure away from the light emitting unit.

### Claim 15 (depends on 14)

The manufacturing method according to claim 14, wherein while the color filter layer is formed, the manufacturing method further comprises:
performing thermal quenching on the quantum dot material in the bonding structure.
