# US 10,770,658 B2 · Method of manufacturing organic light-emitting device and method of manufacturing display unit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,658 B2 - Document ID: US10770658B2 - Status: Granted - Kind: B2 - Application number: 16/431,325 - Filed: 2019-06-04 - Published: 2019-10-31 - Granted: 2020-09-08 - Earliest claimed: 2013-09-19 - Assignees: Joled Inc. - Applicants: JOLED Inc. - Inventors: Makoto Ando; Jun Yamaguchi; Masanobu Tanaka; Tomoo Fukuda; Ryo Yasumatsu; Toshio Fukuda - Web page: https://patentgrep.com/patent/US10770658B2 ## CPC - H10K 59/35: comprising red-green-blue [RGB] subpixels - H10K 50/11: characterised by the electroluminescent [EL] layers - H10K 50/13: comprising stacked EL layers within one EL unit - H10K 59/122: Pixel-defining structures or layers, e.g. banks - H10K 71/13: using printing techniques, e.g. ink-jet printing or screen printing - H10K 71/135: {using ink-jet printing} - H10K 71/166: {using selective deposition, e.g. using a mask} - H10K 71/221: {by lift-off techniques} - H10K 71/236: {using printing techniques, e.g. applying the etch liquid using an ink jet printer} - H10K 71/40: Thermal treatment, e.g. annealing in the presence of a solvent vapour - H10K 59/1201: {Manufacture or treatment} - H10K 2102/351: {Thickness} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract There is provided a method of manufacturing an organic light-emitting device including: forming a first organic material layer on a substrate; and forming a mask in a first region on the first organic material layer, and then selectively removing the first organic material layer to form a first organic layer in the first region. ## Claims ### Claim 1 A method of manufacturing a light-emitting device comprising: forming a first organic material layer above a substrate, the first organic material layer providing light emission; forming a first mask on and in direct contact with only a first portion of an intervening layer formed on the first organic material layer, and removing the first organic material layer exclusive of the first portion, thereby forming a first organic layer, wherein the intervening layer is one of an electron injection layer or an electron transport layer. ### Claim 2 (depends on 1) The method of manufacturing the light-emitting device according to claim 1, wherein the first organic material layer is formed by an evaporation method. ### Claim 3 (depends on 1) The method of manufacturing the light-emitting device according to claim 1, further comprising, after forming the first organic layer, removing the first mask by dry etching. ### Claim 4 (depends on 1) The method of manufacturing the light-emitting device according to claim 1, further comprising forming a second organic material layer above the substrate after forming the first organic layer, the second organic material layer providing light emission. ### Claim 5 (depends on 4) The method of manufacturing the light-emitting device according to claim 4, further comprising: forming a second mask on and in direct contact with only a first portion of an intervening layer formed on the second organic material layer, a location of the first portion of the first organic material layer being different than a location of the first portion of the second organic material layer, and removing the second organic material layer exclusive of the first portion of the second organic material layer, thereby forming a second organic layer. ### Claim 6 (depends on 5) The method of manufacturing the light-emitting device according to claim 5, further comprising, after forming the first organic layer and the second organic layer, removing the first mask and the second mask by dry etching. ### Claim 7 (depends on 5) The method of manufacturing the light-emitting device according to claim 5, wherein the second organic light-emitting material layer is formed by an evaporation method. ### Claim 8 (depends on 1) The method of manufacturing the light-emitting device according to claim 1, wherein the first mask is formed from a water-soluble resin. ### Claim 9 (depends on 1) The method of manufacturing the light-emitting device according to claim 1, wherein the first mask is formed from an alcohol-soluble resin. ### Claim 10 A method of manufacturing a light-emitting device comprising: forming a first organic material layer above a substrate, the first organic material layer providing light emission; forming a first resist on and in direct contact with only a first portion of an intervening layer formed on the first organic material layer, and removing the first organic material layer exclusive of the first portion, thereby forming a first organic layer, wherein the intervening layer is one of an electron injection layer or an electron transport layer. ### Claim 11 (depends on 10) The method of manufacturing the light-emitting device according to claim 10, further comprising, after forming the first organic layer, the first resist is removed by dry etching. ### Claim 12 (depends on 10) The method of manufacturing the light-emitting device according to claim 10, further comprising forming a second organic material layer above the substrate after forming the first organic layer, the second organic material layer providing light emission. ### Claim 13 (depends on 12) The method of manufacturing the light-emitting device according to claim 12, further comprising: forming a second resist on and in direct contact with only a first portion of an intervening layer formed on the second organic material layer, a location of the first portion of the first organic material layer being different than a location of the first portion of the second organic material layer, and removing the second organic material layer exclusive of the first portion of the second organic material layer, thereby forming a second organic layer. ### Claim 14 (depends on 13) The method of manufacturing the light-emitting device according to claim 13, further comprising, after forming the first organic layer and the second organic layer, removing the first resist and the second resist by dry etching.