# US 10,770,636 B2 · Light emitting device and manufacturing method thereof

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- Number: US 10,770,636 B2
- Document ID: US10770636B2
- Status: Granted
- Kind: B2
- Application number: 16/274,666
- Filed: 2019-02-13
- Published: 2019-08-15
- Granted: 2020-09-08
- Earliest claimed: 2018-02-14
- Assignees: Epistar Corporation
- Applicants: Epistar Corporation
- Inventors: Shih-An Liao; Ming-Chi Hsu
- Web page: https://patentgrep.com/patent/US10770636B2

## CPC

- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/8506: {Containers}
- H10H 20/851: Wavelength conversion means
- H10H 20/856: Reflecting means
- H10W 90/00: Package configurations
- H10H 20/036: {of packages}
- H10H 20/0362: {of encapsulations}
- H10H 20/0364: {of interconnections}
- H10H 20/852: Encapsulations
- H10H 20/882: {Scattering means (H10H20/82 takes precedence)}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The invention discloses a light-emitting device and a manufacturing method thereof. The light-emitting device comprising: a light-emitting unit, the light-emitting unit comprises a non-light-emitting element and a light-emitting diode; a reflective layer covering the non-light-emitting element; a light-transmitting layer covering the reflective layer and the light-emitting diode; a metal connection layer electrically connecting the non-light-emitting element and the light-emitting diode.

## Claims

### Claim 1

A light-emitting device, comprising:
a light-emitting unit including a non-light-emitting element and a light-emitting diode, wherein the light emitting diode has a first electrode and a second electrode and the non-light-emitting element has a third electrode and a fourth electrode;
a reflective layer covering the non-light-emitting element;
a light-transmitting layer covering the reflective layer and the light-emitting diode; and
a metal connection layer electrically connected to the non-light-emitting element and the light-emitting diode, wherein the metal connection layer has a first connection portion covering at least part of the first electrode and at least part of the fourth electrode and a second connection portion covering at least part of the second electrode and at least part of the third electrode.

### Claim 2 (depends on 1)

The light-emitting device of claim 1, further comprising an insulating layer surrounding the light-transmitting layer.

### Claim 3 (depends on 1)

The light-emitting device of claim 1, wherein the first connection portion surrounds the second connection portion.

### Claim 4 (depends on 1)

The light-emitting device of claim 1, further comprising metal bumps formed on the first electrode, the second electrode, the third electrode and the fourth electrode.

### Claim 5 (depends on 1)

The light-emitting device of claim 1, further comprising an apparatus, the light-emitting unit connected with the apparatus through the metal connection layer.

### Claim 6 (depends on 4)

The light-emitting device of claim 4, further comprising an insulating layer surrounding the metal bumps.

### Claim 7 (depends on 1)

The light-emitting device of claim 1, further comprising metal bumps formed on the first electrode and the second electrode.

### Claim 8 (depends on 7)

The light-emitting device of claim 7, further comprising an apparatus that is connected to the light-emitting unit by the metal bumps.

### Claim 9 (depends on 8)

The light-emitting device of claim 8, further comprising solders connecting the light-emitting unit and the apparatus.

### Claim 10 (depends on 9)

The light-emitting device of claim 9, further comprising metal connection layers located between the metal bumps and the solders.

### Claim 11 (depends on 8)

The light-emitting device of claim 8, wherein the apparatus is a substrate having an electrical connection circuit or an insulating carrier board having a metal circuit.

### Claim 12 (depends on 7)

The light-emitting device of claim 7, further comprising an insulating layer surrounding the light-transmitting layer and the metal bumps.

### Claim 13 (depends on 1)

The light-emitting device of claim 1, wherein the non-light-emitting element is a voltage-stabilizing diode.

### Claim 14 (depends on 13)

The light-emitting device of claim 13, wherein the first electrode is a p-electrode of the light-emitting diode, the second electrode is a n-electrode of the light-emitting diode, the third electrode is a p-electrode of the voltage-stabilizing diode and the fourth electrode is a n-electrode of the voltage-stabilizing diode.

### Claim 15 (depends on 1)

The light-emitting device of claim 1, wherein the reflective layer is a glue layer mixing with titanium dioxide, hafnium oxide, barium sulfate, or aluminum oxide particles.

### Claim 16 (depends on 2)

The light-emitting device of claim 2, wherein the insulating layer is a glue layer.

### Claim 17 (depends on 1)

The light-emitting device of claim 1, further comprising phosphor powder particles mixed into the light-transmitting layer.

### Claim 18 (depends on 17)

The light-emitting device of claim 17, wherein the light-transmitting layer is silicone or epoxy.

### Claim 19 (depends on 1)

The light-emitting device of claim 1, wherein the light-transmitting layer comprises sloped sides.