# US 10,770,626 B2 · Light-emitting dies incorporating wavelength-conversion materials and related methods

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- Number: US 10,770,626 B2
- Document ID: US10770626B2
- Status: Granted
- Kind: B2
- Application number: 16/749,820
- Filed: 2020-01-22
- Published: 2020-05-21
- Granted: 2020-09-08
- Earliest claimed: 2014-02-05
- Assignees: Epistar Corporation
- Applicants: Epistar Corporation
- Inventors: Michael A. Tischler; Alborz Amini; Thomas Pinnington; Henry Ip; Gianmarco Spiga
- Web page: https://patentgrep.com/patent/US10770626B2

## CPC

- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/01: Manufacture or treatment
- H10H 20/8506: {Containers}
- H10H 20/8514: {characterised by their shape, e.g. plate or foil}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10W 90/00: Package configurations
- H10H 20/036: {of packages}
- H10H 20/0361: {of wavelength conversion means}
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/853: characterised by their shape
- H10H 20/882: {Scattering means (H10H20/82 takes precedence)}
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/9413: {on encapsulations}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.

## Claims

### Claim 1

An electronic device comprising:
a plurality of light-emitting elements, each light-emitting element comprising a first bottom surface and a pair of contact pads disposed on the first bottom surface;
a polymeric binder covering the plurality of light-emitting elements, exposing the pair of contact pads, and comprising a flat top surface and a second bottom surface;
a plurality of contact layers connected to the pair of contact pads and the second bottom surface;
an insulating layer disposed under the first bottom surface and connected to the plurality of contact layers; and
a plurality of contacts disposed under the insulating layer and electrically connected to the plurality of contact layers.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein adjacent contact layers of the plurality of contact layers are separated by a first distance, adjacent contacts of the plurality of contacts are separated by a second distance, the second distance is larger than the first distance.

### Claim 3 (depends on 1)

The electronic device of claim 1, wherein a portion of the insulating layer is exposed from the plurality of contacts.

### Claim 4 (depends on 1)

The electronic device of claim 1, wherein the insulating layer and the contact pads are spatially separated from each other.

### Claim 5 (depends on 1)

The electronic device of claim 1, wherein the polymeric binder is wider than the light-emitting element in a lateral dimension.

### Claim 6 (depends on 1)

The electronic device of claim 1, wherein all of the contact pads are covered by the plurality of contact layers.

### Claim 7 (depends on 1)

The electronic device of claim 1, wherein at least one of the plurality of contact layers has a thickness of about 10 nm to 50 μm.

### Claim 8 (depends on 1)

The electronic device of claim 1, wherein the insulating layer and the plurality of light-emitting elements are overlapped with each other.

### Claim 9 (depends on 1)

The electronic device of claim 1, wherein the plurality of contact layers is larger than the plurality of contacts in quantity.

### Claim 10 (depends on 1)

The electronic device of claim 1, wherein the plurality of light-emitting elements emits two or more lights with different wavelengths.

### Claim 11 (depends on 1)

The electronic device of claim 1, wherein the plurality of light-emitting elements emits lights including blue light, green light, and red light.

### Claim 12 (depends on 1)

The electronic device of claim 1, wherein at least one of the plurality of contacts has a varying thickness.

### Claim 13 (depends on 1)

The electronic device of claim 1, wherein the plurality of contacts has a first thickness which is under the light-emitting element, and a second thickness which is not under the light-emitting element, and the second thickness is larger than the first thickness.