# US 10,770,624 B2 · Semiconductor device package, optical package, and method for manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,624 B2 - Document ID: US10770624B2 - Status: Granted - Kind: B2 - Application number: 16/132,206 - Filed: 2018-09-14 - Published: 2019-04-18 - Granted: 2020-09-08 - Earliest claimed: 2017-10-12 - Assignees: Advanced Semiconductor Engineering, Inc. - Applicants: Advanced Semiconductor Engineering, Inc. - Inventors: Chang Chin Tsai; Chun-Han Chen; Hsin-Ying Ho - Web page: https://patentgrep.com/patent/US10770624B2 ## CPC - H10H 20/8506: {Containers} - H01S 5/02234: Resin-filled housings; the housings being made of resin - H01S 5/0231: Stems - H01S 5/02345: Wire-bonding - H01S 5/0237: by soldering - H01S 5/02375: Positioning of the laser chips - H01S 5/4031: {Edge-emitting structures} - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H01S 5/02208: characterised by the shape of the housings - H01S 5/02253: using lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 20/43: Layouts of interconnections - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided. ## Claims ### Claim 1 A semiconductor package, comprising: a first substrate having a first surface; a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface connected to the first surface of the second substrate, a surface area of the first surface of the second substrate being less than a surface area of the second surface, and the first surface of the second substrate being disposed on the first surface of the first substrate; and a light source on the second surface of the second substrate. ### Claim 2 (depends on 1) The semiconductor package of claim 1, further comprising a support structure between the first surface of the first substrate and the first surface of the second substrate. ### Claim 3 (depends on 1) The semiconductor package of claim 1, further comprising a protection element covering the light source and the second substrate. ### Claim 4 (depends on 3) The semiconductor package of claim 3, further comprising an optical element over the protection element. ### Claim 5 (depends on 3) The semiconductor package of claim 3, wherein the protection element comprises a molding material, silicone, or glass. ### Claim 6 (depends on 3) The semiconductor package of claim 3, wherein the protection element is separated from the light source by a space. ### Claim 7 (depends on 1) The semiconductor package of claim 1, wherein the light source comprises a light-emitting surface opposite to the first surface of the second substrate. ### Claim 8 (depends on 1) The semiconductor package of claim 1, further comprising a housing, the housing being disposed on the first surface of the first substrate to surround the second substrate and the light source. ### Claim 9 (depends on 1) The semiconductor package of claim 1, wherein the second substrate comprises a conductive via electrically coupled to the first substrate through a conductive material. ### Claim 10 (depends on 1) The semiconductor package of claim 1, further comprising an interposer between the second surface of the second substrate and the light source. ### Claim 11 (depends on 1) The optical package structure of claim 1, wherein the light source comprises a first projection area on the first surface of the first substrate and a second projection area on the second substrate, wherein the first projection area is smaller than the second projection area. ### Claim 12 An optical package structure, comprising: a substrate having a first surface; a light source on the first surface of the substrate, the light source having a light-emitting surface, a first surface opposite to the light-emitting surface, and a second surface between the light-emitting surface and the first surface, the first surface of the light source facing the first surface of the substrate, and a carrier between the light source and the substrate, wherein the light source comprises a first projection area on the first surface of the substrate and a second projection area on the carrier, wherein the first projection area is smaller than the second projection area. ### Claim 13 (depends on 12) The optical package structure of claim 12, further comprising a protection element covering the light source. ### Claim 14 (depends on 13) The optical package structure of claim 13, wherein the protection element comprises a third surface adjacent to the light-emitting surface of the light source and a fourth surface protruded from the third surface of the protection element. ### Claim 15 (depends on 13) The optical package structure of claim 13, wherein the protection element comprises a protrusion structure in proximity to the light-emitting surface. ### Claim 16 A method of manufacturing an optical package structure, comprising: providing a substrate; providing an optical module, the optical module comprising: a carrier having a first surface and a second surface connected to the first surface, a surface area of the second surface being less than a surface area of the first surface; an edge emitting device on the first surface and electrically coupled to the carrier, the edge emitting device comprising a light emitting surface; and a protection element covering the edge emitting device and the carrier; forming a support structure over the substrate; and integrating the optical module with the substrate via the support structure, the light emitting surface being distal to the substrate. ### Claim 17 (depends on 16) The method of claim 16, wherein forming the support structure comprises forming a non-conductive layer over the substrate. ### Claim 18 (depends on 16) The method of claim 16, further comprising: disposing a conductive bump over the substrate; and connecting a conductive terminal of the carrier to the conductive bump. ### Claim 19 (depends on 16) The method of claim 16, wherein forming the protection element comprises forming a molding material surrounding the carrier and the edge-emitting device or disposing a lid to cover the carrier and the edge-emitting device. ### Claim 20 (depends on 16) The optical package structure of claim 16, wherein the edge emitting device comprises a first projection area on a first surface of the substrate and a second projection area on the carrier, wherein the first projection area is smaller than the second projection area.