# US 10,770,494 B2 · Imaging assembly, method and molding mold for fabricating same, camera module, and smart terminal > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,494 B2 - Document ID: US10770494B2 - Status: Granted - Kind: B2 - Application number: 16/102,165 - Filed: 2018-08-13 - Published: 2019-02-14 - Granted: 2020-09-08 - Earliest claimed: 2017-08-14 - Assignees: Ningbo Sunny Opotech Co., Ltd. - Applicants: Ningbo Sunny Opotech Co., Ltd. - Inventors: Takehiko Tanaka; Lifeng Yao; Bojie Zhao; Zhewen Mei - Web page: https://patentgrep.com/patent/US10770494B2 ## CPC - H10F 39/804: {Containers or encapsulations} - H10F 39/018: {of hybrid image sensors} - H10F 39/024: {of coatings or optical elements} - H10F 39/8053: {Colour filters} - H10F 39/806: {Optical elements or arrangements associated with the image sensors} - H10F 39/809: {of hybrid image sensors} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract The present application provides an imaging assembly, a method and molding mold for fabricating same, a camera module, and a smart terminal. According to an aspect of the present application, the imaging assembly includes a photosensitive element and a molded encapsulation portion. The photosensitive element has a photosensitive area. The molded encapsulation portion is formed around the photosensitive area and is in contact with the photosensitive element. The molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area. A height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses. ## Claims ### Claim 1 An imaging assembly, comprising: a photosensitive element, having a photosensitive area; and a molded encapsulation portion, formed around the photosensitive area, directly contacting the photosensitive element and completely enclosing the photosensitive element, wherein the molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area, wherein a height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses. ### Claim 2 (depends on 1) The imaging assembly according to claim 1, wherein a reflectance of the inclined inner side surface of the molded encapsulation portion to visible light is less than or equal to 5%. ### Claim 3 (depends on 1) The imaging assembly according to claim 1, wherein an arithmetic mean deviation of a surface roughness profile of the inclined inner side surface of the molded encapsulation portion is greater than or equal to 1 μm. ### Claim 4 (depends on 1) The imaging assembly according to claim 1, wherein an arithmetic mean deviation of a surface roughness profile of the top surface of the molded encapsulation portion is greater than an arithmetic mean deviation of a surface roughness profile of the inclined inner side surface. ### Claim 5 (depends on 1) The imaging assembly according to claim 1, wherein an angle of inclination of the inclined inner side surface with respect to the photosensitive area is between 20 and 70 degrees. ### Claim 6 (depends on 1) The imaging assembly according to claim 1, wherein the molded encapsulation portion has a size that satisfies a following inequation: 5d(1/sin α−1/tan α)≤(b1+2b2), wherein, d represents a height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element, a represents an angle of inclination of the inclined inner side surface with respect to the photosensitive area, b1 represents a distance between opposite inclined inner side surfaces on the photosensitive area, and b2 represents a length of an orthographic projection of the inclined inner side surface on a plane encompassing the photosensitive area. ### Claim 7 (depends on 1) The imaging assembly according to claim 1, wherein the molded encapsulation portion has a size that satisfies a following inequation: d1(1/sin α1−1/tan α1)+d2(1/sin α2−1/tan α2)≤0.4(b1+b2+b3), wherein, d1 and d2 represent height differences between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element, a1 and a2 represent angles of inclination of the inclined inner side surface with respect to the photosensitive area, b1 represents a distance between opposite inclined inner side surfaces on the photosensitive area, and b2 and b3 represent lengths of orthographic projections of the inclined inner side surface on a plane encompassing the photosensitive area. ### Claim 8 A method for fabricating an imaging assembly, comprising: mounting a photosensitive element on a circuit board of an imaging assembly to be fabricated; attaching a flexible film to a lower portion of a molding mold, wherein the flexible film has a non-smooth surface facing away from the molding mold, the lower portion of the molding mold comprises a pressure head and a module portion located around the pressure head, and the pressure head has an inwardly inclined surface at an edge of the pressure head; disposing the molding mold with the flexible film onto the photosensitive element, so that a height difference between a bottom surface of the module portion facing the photosensitive element and a top surface of the photosensitive element is less than or equal to 0.7 mm; and molding a molded encapsulation portion around the photosensitive element, between the bottom surface of the module portion facing the photosensitive element and the top surface of the photosensitive element, and surrounding the inwardly inclined surface at the edge of the pressure head, so that an inclined inner side surface formed on the molded encapsulation portion adjacent to the inwardly inclined surface has a non-smooth surface corresponding to the non-smooth surface of the flexible film attached on the inwardly inclined surface. ### Claim 9 (depends on 8) The method according to claim 8, wherein a reflectance of the inclined inner side surface of the molded encapsulation portion to visible light is less than or equal to 5%. ### Claim 10 (depends on 8) The method according to claim 8, wherein an arithmetic mean deviation of a surface roughness profile of the inclined inner side surface of the molded encapsulation portion is greater than or equal to 1 μm. ### Claim 11 (depends on 8) The method according to claim 8, wherein an arithmetic mean deviation of a surface roughness profile of the non-smooth surface of the flexible film attached on the module portion is greater than an arithmetic mean deviation of a surface roughness profile of the non-smooth surface of the flexible film attached on the inwardly inclined surface. ### Claim 12 (depends on 8) The method according to claim 8, wherein the disposing the molding mold with the flexible film onto the photosensitive element comprises: pressing the pressure head with the flexible film directly against the photosensitive area of the photosensitive element. ### Claim 13 (depends on 12) The method according to claim 12, wherein an angle of inclination of the inwardly inclined surface with respect to the photosensitive area is between 20 and 70 degrees. ### Claim 14 (depends on 8) The method according to claim 8, wherein after the flexible film is attached to the lower portion of the molding mold, a resulting stretching coefficient K of the flexible film is less than or equal to 1.4, wherein K=1+2d(1/sin α−1/tan α)/(b1+2b2), wherein, d represents a height difference between the bottom surface of the module portion facing the photosensitive element and the top surface of the photosensitive element, a represents an angle of inclination of the inwardly inclined surface with respect to the top surface of the photosensitive element, b1 represents a distance between the inwardly inclined surfaces of the pressure head, and b2 represents a length of an orthographic projection of the inwardly inclined surface on the top surface of the photosensitive element. ### Claim 15 (depends on 8) The method according to claim 8, wherein after the flexible film is attached to the lower portion of the molding mold, a resulting stretching coefficient K of the flexible film is less than or equal to 1.4, wherein K=1+(d1(1/sin α1−1/tan α1)+d2(1/sin α2−1/tan α2))/(b1+b2+b3), wherein, d1 and d2 represent height differences between the bottom surface of the module portion facing the photosensitive element and the top surface of the photosensitive element, a1 and a2 represent angles of inclination of the inwardly inclined surface with respect to the top surface of the photosensitive element, b1 represents a distance between the inwardly inclined surfaces of the pressure head, and b2 and b3 represent lengths of orthographic projections of the inwardly inclined surface on the top surface of the photosensitive element. ### Claim 16 (depends on 8) The method according to claim 8, wherein the flexible film has an anti-adhesive surface facing toward the molding mold. ### Claim 17 (depends on 8) The method according to claim 8, wherein the flexible film is made of one or more materials selected from group consisting of ETFE, PTFE, PFA, FEP, and PS.